MARIE KRYSAK

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal oxycarbide resists as leave behind plugs
- Patent number 12,107,044
- Issue date Oct 1, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical compositions and methods of patterning microelectronic dev...
- Patent number 12,037,434
- Issue date Jul 16, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly structures and techniques
- Patent number 12,012,473
- Issue date Jun 18, 2024
- Intel Corporation
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV patterning methods, structures, and materials
- Patent number 11,984,317
- Issue date May 14, 2024
- Intel Corporation
- Marie Krysak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,955,343
- Issue date Apr 9, 2024
- Intel Corporation
- Robert L. Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,953,826
- Issue date Apr 9, 2024
- Intel Corporation
- James M. Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,874,600
- Issue date Jan 16, 2024
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,862,463
- Issue date Jan 2, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chain scission photoresists and methods for forming chain scission...
- Patent number 11,846,883
- Issue date Dec 19, 2023
- Intel Corporation
- Robert Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Activation of protected cross-linking catalysts during formation of...
- Patent number 11,406,972
- Issue date Aug 9, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,320,734
- Issue date May 3, 2022
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,315,798
- Issue date Apr 26, 2022
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chain scission resist compositions for EUV lithography applications
- Patent number 11,262,654
- Issue date Mar 1, 2022
- Intel Corporation
- Lauren Doyle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,251,072
- Issue date Feb 15, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,227,766
- Issue date Jan 18, 2022
- Intel Corporation
- Marie Krysak
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Selective etching and controlled atomic layer etching of transition...
- Patent number 11,217,456
- Issue date Jan 4, 2022
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch quartered three-dimensional air gaps
- Patent number 11,152,254
- Issue date Oct 19, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,137,681
- Issue date Oct 5, 2021
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardened plug for improved shorting margin
- Patent number 11,024,538
- Issue date Jun 1, 2021
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,971,394
- Issue date Apr 6, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 10,892,223
- Issue date Jan 12, 2021
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Means to decouple the diffusion and solubility switch mechanisms of...
- Patent number 10,692,757
- Issue date Jun 23, 2020
- Intel Corporation
- Marie Krysak
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Via blocking layer
- Patent number 10,672,650
- Issue date Jun 2, 2020
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via blocking layer
- Patent number 10,535,601
- Issue date Jan 14, 2020
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,256,141
- Issue date Apr 9, 2019
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via blocking layer
- Patent number 9,899,255
- Issue date Feb 20, 2018
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20240360264
- Publication date Oct 31, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST
- Publication number 20240201586
- Publication date Jun 20, 2024
- Intel Corporation
- James Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...
- Publication number 20220229364
- Publication date Jul 21, 2022
- Intel Corporation
- Marie KRYSAK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
- Publication number 20220216065
- Publication date Jul 7, 2022
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED VIAS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199540
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...
- Publication number 20220199462
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY
- Publication number 20220130719
- Publication date Apr 28, 2022
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS
- Publication number 20220093399
- Publication date Mar 24, 2022
- Intel Corporation
- Marie KRYSAK
- C01 - INORGANIC CHEMISTRY
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20210397084
- Publication date Dec 23, 2021
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20210371566
- Publication date Dec 2, 2021
- Intel Corporation
- Eungnak Han
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS
- Publication number 20210375616
- Publication date Dec 2, 2021
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
- Publication number 20210375745
- Publication date Dec 2, 2021
- Intel Corporation, Santa Clara, CA
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS
- Publication number 20210200085
- Publication date Jul 1, 2021
- Intel Corporation
- Lauren Doyle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20210082800
- Publication date Mar 18, 2021
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING AND CONTROLLED ATOMIC LAYER ETCHING OF TRANSITION...
- Publication number 20200395223
- Publication date Dec 17, 2020
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXYCARBIDE RESISTS AS LEAVE BEHIND PLUGS
- Publication number 20200335434
- Publication date Oct 22, 2020
- Intel Corporation
- Marie KRYSAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION PHOTORESISTS AND METHODS FOR FORMING CHAIN SCISSION...
- Publication number 20200103754
- Publication date Apr 2, 2020
- Intel Corporation
- Robert BRISTOL
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HARDENED PLUG FOR IMPROVED SHORTING MARGIN
- Publication number 20200098629
- Publication date Mar 26, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20200066629
- Publication date Feb 27, 2020
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH QUARTERED THREE-DIMENSIONAL AIR GAPS
- Publication number 20190385897
- Publication date Dec 19, 2019
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY
- Publication number 20190318959
- Publication date Oct 17, 2019
- Intel Corporation
- Kevin L. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...
- Publication number 20190302615
- Publication date Oct 3, 2019
- Intel Corporation
- Marie KRYSAK
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS
- Publication number 20190237329
- Publication date Aug 1, 2019
- Intel Corporation
- Marie KRYSAK
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH
- Publication number 20190189500
- Publication date Jun 20, 2019
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20190146335
- Publication date May 16, 2019
- Intel Corporation
- James M. BLACKWELL
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
VIA BLOCKING LAYER
- Publication number 20190122982
- Publication date Apr 25, 2019
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
- Publication number 20190043731
- Publication date Feb 7, 2019
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVATION OF PROTECTED CROSS-LINKING CATALYSTS DURING FORMATION OF...
- Publication number 20180236440
- Publication date Aug 23, 2018
- Intel Corporation
- James M. BLACKWELL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

MARIE KRYSAK

Person

Patents Grantslast 30 patents

Metal oxycarbide resists as leave behind plugs

Chemical compositions and methods of patterning microelectronic dev...

Directed self-assembly structures and techniques

EUV patterning methods, structures, and materials

Two-stage bake photoresist with releasable quencher

Lined photobucket structure for back end of line (BEOL) interconnec...

Differential hardmasks for modulation of electrobucket sensitivity

Ligand-capped main group nanoparticles as high absorption extreme u...

Metal oxide nanoparticles as fillable hardmask materials

Advanced lithography and self-assembled devices

Chain scission photoresists and methods for forming chain scission...

Activation of protected cross-linking catalysts during formation of...

Advanced lithography and self-assembled devices

Ligand-capped main group nanoparticles as high absorption extreme u...

Two-stage bake photoresist with releasable quencher

Chain scission resist compositions for EUV lithography applications

Differential hardmasks for modulation of electrobucket sensitivity

Metal oxide nanoparticles as fillable hardmask materials

Selective etching and controlled atomic layer etching of transition...

Pitch quartered three-dimensional air gaps

Lined photobucket structure for back end of line (BEOL) interconnec...

Hardened plug for improved shorting margin

Maskless air gap to prevent via punch through

Advanced lithography and self-assembled devices

Means to decouple the diffusion and solubility switch mechanisms of...

Via blocking layer

Via blocking layer

Maskless air gap to prevent via punch through

Via blocking layer

Patents Applicationslast 30 patents

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...

TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER

GUIDED VIAS IN MICROELECTRONIC STRUCTURES

VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...

DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY

METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS

DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

SELECTIVE ETCHING AND CONTROLLED ATOMIC LAYER ETCHING OF TRANSITION...

METAL OXYCARBIDE RESISTS AS LEAVE BEHIND PLUGS

CHAIN SCISSION PHOTORESISTS AND METHODS FOR FORMING CHAIN SCISSION...

HARDENED PLUG FOR IMPROVED SHORTING MARGIN

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

PITCH QUARTERED THREE-DIMENSIONAL AIR GAPS

DIFFERENTIAL HARDMASKS FOR MODULATION OF ELECTROBUCKET SENSITIVITY

LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...

METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS

MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

VIA BLOCKING LAYER

TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER

ACTIVATION OF PROTECTED CROSS-LINKING CATALYSTS DURING FORMATION OF...