Mario J. Interrante

Person

New Paltz, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,262,970
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,860,996
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,431,366
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bonding with interposer die
- Patent number 9,373,590
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D bond and assembly process for severely bowed interposer die
- Patent number 9,224,712
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Marcus E. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,105,629
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D assembly for interposer bow
- Patent number 9,059,241
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming integrated circuit assembly
- Patent number 8,689,437
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Bing Dang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,614,512
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having offset passivation to reduce electro...
- Patent number 8,487,447
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,383,505
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to recover underfilled modules by selective removal of discr...
- Patent number 7,781,232
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free alloys for column/ball grid arrays, organic interposers a...
- Patent number 6,917,113
- Issue date Jul 12, 2005
- International Business Machines Corporatiion
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder hierarchy for lead free solder joint
- Patent number 6,892,925
- Issue date May 17, 2005
- International Business Machines Corporation
- Mario Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for lead free solder electronic package interc...
- Patent number 6,854,636
- Issue date Feb 15, 2005
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic package structure and process for planar passive opt...
- Patent number 6,827,505
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing solder wetting in an optical device using diff...
- Patent number 6,762,119
- Issue date Jul 13, 2004
- International Bussiness Machines Corporation
- Sudipta K. Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for semiconductor chip carriers
- Patent number 6,740,959
- Issue date May 25, 2004
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection process for module assembly and rework
- Patent number 6,574,859
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Shaji Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrical connector
- Patent number 6,532,654
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,518,674
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Mario J. Interrante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing interconnections
- Patent number 6,497,357
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Raymond A. Jackson
- B08 - CLEANING
Information Patent Grant
Conductive adhesive interconnection with insulating polymer carrier
- Patent number 6,458,623
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density column grid array connections and method thereof
- Patent number 6,429,388
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,360,938
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary attach article and method for temporary attach of devices...
- Patent number 6,303,400
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial connection apparatus and method of attachment
- Patent number 6,302,732
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Mark Budman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical attachment means used as electrical connection
- Patent number 6,287,126
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Michael Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20180350768
- Publication date Dec 6, 2018
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20180084649
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
- Publication number 20170358552
- Publication date Dec 14, 2017
- International Business Machines Corporation
- William E. BREINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20160330848
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20160329218
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20160233190
- Publication date Aug 11, 2016
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BONDING WITH INTERPOSER DIE
- Publication number 20160190071
- Publication date Jun 30, 2016
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20150235986
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
- Publication number 20150228614
- Publication date Aug 13, 2015
- International Business Machines Corporation
- MARCUS E INTERRANTE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20140256090
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer for ESD, EMI, and EMC
- Publication number 20130082365
- Publication date Apr 4, 2013
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20130015579
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...
- Publication number 20120292779
- Publication date Nov 22, 2012
- International Business Machines Corporation
- MARIO J. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20120256313
- Publication date Oct 11, 2012
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20100326702
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCR...
- Publication number 20090184407
- Publication date Jul 23, 2009
- International Business Machines Corporation
- Charles L. Arvin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods and Apparatus for Assembling Integrated Circuit Device Util...
- Publication number 20090085202
- Publication date Apr 2, 2009
- Bing Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKABLE CHIP STACK
- Publication number 20080206960
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PREPARING AND ASSEMBLING A SOLDERED SUBSTRATE
- Publication number 20070158395
- Publication date Jul 12, 2007
- International Business Machines Corporation
- Benjamin V. Fasano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS
- Publication number 20070007323
- Publication date Jan 11, 2007
- International Business Machines Corporation
- David J. Russell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for lead free solder electronic package interc...
- Publication number 20050106059
- Publication date May 19, 2005
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS A...
- Publication number 20040212094
- Publication date Oct 28, 2004
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic package structure and process for planar passive opt...
- Publication number 20040114884
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Subhash L. Shinde
- G02 - OPTICS
Information Patent Application
Structure and method for lead free solder electronic package interc...
- Publication number 20040108367
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder hierarchy for lead free solder joint
- Publication number 20040050904
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Mario Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI shielding for semiconductor chip carriers
- Publication number 20030025180
- Publication date Feb 6, 2003
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure and process for silicon optical bench
- Publication number 20020196996
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Sudipta K. Ray
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING INTERCONNECTIONS
- Publication number 20020162880
- Publication date Nov 7, 2002
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an electrical connector
- Publication number 20020092164
- Publication date Jul 18, 2002
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS

Mario J. Interrante

Person

Patents Grantslast 30 patents

Selective area heating for 3D chip stack

Selective area heating for 3D chip stack

Selective area heating for 3D chip stack

Selective area heating for 3D chip stack

Integrated circuit bonding with interposer die

3D bond and assembly process for severely bowed interposer die

Selective area heating for 3D chip stack

3D assembly for interposer bow

Method for forming integrated circuit assembly

Solder ball contact susceptible to lower stress

Semiconductor structure having offset passivation to reduce electro...

Solder ball contact susceptible to lower stress

Method to recover underfilled modules by selective removal of discr...

Lead-free alloys for column/ball grid arrays, organic interposers a...

Solder hierarchy for lead free solder joint

Structure and method for lead free solder electronic package interc...

Optoelectronic package structure and process for planar passive opt...

Method of preventing solder wetting in an optical device using diff...

EMI shielding for semiconductor chip carriers

Interconnection process for module assembly and rework

Method of forming an electrical connector

Temporary attach article and method for temporary attach of devices...

Apparatus and method for removing interconnections

Conductive adhesive interconnection with insulating polymer carrier

High density column grid array connections and method thereof

Process and apparatus to remove closely spaced chips on a multi-chi...

Temporary attach article and method for temporary attach of devices...

Coaxial connection apparatus and method of attachment

Mechanical attachment means used as electrical connection

Method for enhancing fatigue life of ball grid arrays

Patents Applicationslast 30 patents

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...

SELECTIVE AREA HEATING FOR 3D CHIP STACK

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

INTEGRATED CIRCUIT BONDING WITH INTERPOSER DIE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

3D ASSEMBLY FOR INTERPOSER BOW

Interposer for ESD, EMI, and EMC

SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS

SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...

SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS

INTEGRATED CIRCUIT ASSEMBLY

METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCR...

Methods and Apparatus for Assembling Integrated Circuit Device Util...

REWORKABLE CHIP STACK

METHOD FOR PREPARING AND ASSEMBLING A SOLDERED SUBSTRATE

STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS

Structure and method for lead free solder electronic package interc...

LEAD-FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS A...

Optoelectronic package structure and process for planar passive opt...

Structure and method for lead free solder electronic package interc...

Solder hierarchy for lead free solder joint

EMI shielding for semiconductor chip carriers

Interconnect structure and process for silicon optical bench

APPARATUS AND METHOD FOR REMOVING INTERCONNECTIONS

Method of forming an electrical connector