Mark A. Bachman

Person

Sinking Spring, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of shallow trench isolation and through-substrate vias...
- Patent number 9,613,847
- Issue date Apr 4, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pb-free solder bumps with improved mechanical properties
- Patent number 9,443,821
- Issue date Sep 13, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interconnect heat sink
- Patent number 9,054,064
- Issue date Jun 9, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark A Bachman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of through-substrate vias
- Patent number 8,987,137
- Issue date Mar 24, 2015
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PB-free solder bumps with improved mechanical properties
- Patent number 8,779,587
- Issue date Jul 15, 2014
- Agere Systems LLC
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of shallow trench isolation and through-substrate vias...
- Patent number 8,742,535
- Issue date Jun 3, 2014
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,580,621
- Issue date Nov 12, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
- Patent number 8,507,317
- Issue date Aug 13, 2013
- Agere Systems LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interconnect heat sink
- Patent number 8,492,911
- Issue date Jul 23, 2013
- LSI Corporation
- Mark A. Bachman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect by addition of copper
- Patent number 8,378,485
- Issue date Feb 19, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
- Patent number 7,952,206
- Issue date May 31, 2011
- Agere Systems Inc.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating flip chip devices
- Patent number 7,777,333
- Issue date Aug 17, 2010
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electronic entities
- Patent number 7,724,359
- Issue date May 25, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packages
- Patent number 7,671,436
- Issue date Mar 2, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low thermal resistance assembly for flip chip applications
- Patent number 7,479,695
- Issue date Jan 20, 2009
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for bonding to copper interconnect structures
- Patent number 7,328,830
- Issue date Feb 12, 2008
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for testing a semiconductor wafer prior to pe...
- Patent number 7,221,173
- Issue date May 22, 2007
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad
- Patent number 6,960,836
- Issue date Nov 1, 2005
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTERCONNECT HEAT SINK
- Publication number 20150214130
- Publication date Jul 30, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES
- Publication number 20140284376
- Publication date Sep 25, 2014
- AGERE SYSTEMS LLC
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...
- Publication number 20140220760
- Publication date Aug 7, 2014
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
- Publication number 20140015127
- Publication date Jan 16, 2014
- AGERE SYSTEMS LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERCONNECT HEAT SINK
- Publication number 20130280864
- Publication date Oct 24, 2013
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT BY ADDITION OF COPPER
- Publication number 20130149857
- Publication date Jun 13, 2013
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...
- Publication number 20120153430
- Publication date Jun 21, 2012
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS
- Publication number 20120153492
- Publication date Jun 21, 2012
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERCONNECT HEAT SINK
- Publication number 20120020028
- Publication date Jan 26, 2012
- LSI Corporation
- Mark A. Bachman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110195544
- Publication date Aug 11, 2011
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES
- Publication number 20110163441
- Publication date Jul 7, 2011
- Agere Systems Inc.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPRESSING FRACTURES IN DICED INTEGRATED CIRCUITS
- Publication number 20110006389
- Publication date Jan 13, 2011
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT BY ADDITION OF COPPER
- Publication number 20110006415
- Publication date Jan 13, 2011
- LSI Corporation
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
- Publication number 20100319967
- Publication date Dec 23, 2010
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PAD FOR COPPER WIRE BONDING
- Publication number 20100052174
- Publication date Mar 4, 2010
- Agere Systems Inc.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making electronic entities
- Publication number 20090298286
- Publication date Dec 3, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic packages
- Publication number 20090273078
- Publication date Nov 5, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and Method for Fabricating Flip Chip Devices
- Publication number 20090072393
- Publication date Mar 19, 2009
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low thermal resistance assembly for flip chip applications
- Publication number 20070216034
- Publication date Sep 20, 2007
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20070069394
- Publication date Mar 29, 2007
- Agere Systems Inc.
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20070063352
- Publication date Mar 22, 2007
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structures for testing a semiconductor wafer prior to pe...
- Publication number 20060066327
- Publication date Mar 30, 2006
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and system for reinforcing a bond pad
- Publication number 20050067709
- Publication date Mar 31, 2005
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for bonding to copper interconnect structures
- Publication number 20040182915
- Publication date Sep 23, 2004
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS

Mark A. Bachman

Person

Patents Grantslast 30 patents

Integration of shallow trench isolation and through-substrate vias...

Pb-free solder bumps with improved mechanical properties

Stacked interconnect heat sink

Method of fabrication of through-substrate vias

PB-free solder bumps with improved mechanical properties

Integration of shallow trench isolation and through-substrate vias...

Solder interconnect by addition of copper

Solder bump structure for flip chip semiconductor devices and metho...

Stacked interconnect heat sink

Solder interconnect by addition of copper

Routing under bond pad for the replacement of an interconnect layer

Solder bump structure for flip chip semiconductor devices and metho...

Structure and method for fabricating flip chip devices

Method of making electronic entities

Electronic packages

Low thermal resistance assembly for flip chip applications

Structure and method for bonding to copper interconnect structures

Method and structures for testing a semiconductor wafer prior to pe...

Reinforced bond pad

Patents Applicationslast 30 patents

STACKED INTERCONNECT HEAT SINK

PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES

INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...

CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...

STACKED INTERCONNECT HEAT SINK

SOLDER INTERCONNECT BY ADDITION OF COPPER

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...

METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS

STACKED INTERCONNECT HEAT SINK

SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...

PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES

SUPPRESSING FRACTURES IN DICED INTEGRATED CIRCUITS

SOLDER INTERCONNECT BY ADDITION OF COPPER

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

COPPER PAD FOR COPPER WIRE BONDING

Method of making electronic entities

Electronic packages

Structure and Method for Fabricating Flip Chip Devices

Low thermal resistance assembly for flip chip applications

SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Method and structures for testing a semiconductor wafer prior to pe...

Methods and system for reinforcing a bond pad

Structure and method for bonding to copper interconnect structures