Mark A. Bossler

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 9,780,052
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising at least one through-substrate...
- Patent number 9,318,438
- Issue date Apr 19, 2016
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selectively removing a substrate material
- Patent number 9,034,769
- Issue date May 19, 2015
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified facet etch to prevent blown gate oxide and increase etch c...
- Patent number 7,262,136
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- William A. Polinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified facet etch to prevent blown gate oxide and increase etch c...
- Patent number 6,762,125
- Issue date Jul 13, 2004
- Micron Technology, Inc.
- William A. Polinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming a faceted opening and a layer fill...
- Patent number 6,727,158
- Issue date Apr 27, 2004
- Micron Technology, Inc.
- Dirk J. Sundt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170352633
- Publication date Dec 7, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170077052
- Publication date Mar 16, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures comprising at least one through-substrate...
- Publication number 20150214160
- Publication date Jul 30, 2015
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY REMOVING A SUBSTRATE MATERIAL AND RELATED SE...
- Publication number 20140159239
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified Facet Etch to Prevent Blown Gate Oxide and Increase Etch C...
- Publication number 20070278611
- Publication date Dec 6, 2007
- Micron Technology, Inc.
- William A. Polinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified facet etch to prevent blown gate oxide and increase etch c...
- Publication number 20040248355
- Publication date Dec 9, 2004
- William A. Polinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for forming a faceted opening and layer fillin...
- Publication number 20040046229
- Publication date Mar 11, 2004
- Dirk J. Sundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for forming a faceted opening and a layer fill...
- Publication number 20030085444
- Publication date May 8, 2003
- Dirk J. Sundt
- H01 - BASIC ELECTRIC ELEMENTS

Mark A. Bossler

Person

Patents Grantslast 30 patents

Collars for under-bump metal structures and associated systems and...

Semiconductor structures comprising at least one through-substrate...

Methods of selectively removing a substrate material

Modified facet etch to prevent blown gate oxide and increase etch c...

Modified facet etch to prevent blown gate oxide and increase etch c...

Structure and method for forming a faceted opening and a layer fill...

Patents Applicationslast 30 patents

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Semiconductor structures comprising at least one through-substrate...

METHODS OF SELECTIVELY REMOVING A SUBSTRATE MATERIAL AND RELATED SE...

Modified Facet Etch to Prevent Blown Gate Oxide and Increase Etch C...

Modified facet etch to prevent blown gate oxide and increase etch c...

Structure and method for forming a faceted opening and layer fillin...

Structure and method for forming a faceted opening and a layer fill...