Mark A. Kressley

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for packaging a microelectromechanical system (MEMS) device
- Patent number 8,627,566
- Issue date Jan 14, 2014
- Texas Instruments Incorporated
- Moody K. Forgey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ceramic header method
- Patent number 7,690,106
- Issue date Apr 6, 2010
- Texas Instruments Incorporated
- Moody K. Forgey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit capacitor and memory
- Patent number 6,600,183
- Issue date Jul 29, 2003
- Texas Instruments Incorporated
- Mark R. Visokay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump transfer for microelectronics packaging and assembly
- Patent number 5,646,068
- Issue date Jul 8, 1997
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a field emission device anode plate having m...
- Patent number 5,558,554
- Issue date Sep 24, 1996
- Texas Instruments Inc.
- John E. Finklea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional assembly of integrated circuit chips
- Patent number 5,327,327
- Issue date Jul 5, 1994
- Texas Instruments Incorporated
- Dean L. Frew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ceramic Header Method and System
- Publication number 20100188729
- Publication date Jul 29, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Moody K. Forgey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ceramic header method and system
- Publication number 20080099240
- Publication date May 1, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Moody K. Forgey
- B81 - MICRO-STRUCTURAL TECHNOLOGY