Mark A. Kuhlman

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Laguna Niguel, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising a solder resist layer configured as a seating pl...
- Patent number 11,626,336
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Daniel Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D stacking of active devices over passive devices
- Patent number 9,955,582
- Issue date Apr 24, 2018
- Skyworks Solutions, Inc.
- Mark A. Kuhlman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-shielded die having electromagnetic shielding on die surfaces
- Patent number 9,922,937
- Issue date Mar 20, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark Kuhlman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method and structure for securing a mold compound to a printed circ...
- Patent number 6,903,270
- Issue date Jun 7, 2005
- Skyworks Solutions, Inc.
- Doug A. Hawks
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PL...
- Publication number 20210098320
- Publication date Apr 1, 2021
- QUALCOMM Incorporated
- Daniel GARCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20180242455
- Publication date Aug 23, 2018
- SKYWORKS SOLUTIONS, INC.
- Mark A. KUHLMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-SHIELDED DIE HAVING ELECTROMAGNETIC SHIELDING ON DIE SURFACES
- Publication number 20180033737
- Publication date Feb 1, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Mark Kuhlman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20090267220
- Publication date Oct 29, 2009
- Mark A. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT
- Publication number 20090127695
- Publication date May 21, 2009
- Patrick Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold compound circuit structure for enhanced electrical and thermal...
- Publication number 20080315396
- Publication date Dec 25, 2008
- SKYWORKS SOLUTIONS, INC.
- Mark A. Kuhlman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR