Mark Anthony Azzopardi

Person

Gudja, MT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for soldering a cap to a support layer
- Patent number 9,390,988
- Issue date Jul 12, 2016
- STMicroelectronics (Malta) Ltd.
- Mark A. Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer and corresponding assembly process
- Patent number 8,837,754
- Issue date Sep 16, 2014
- STMicroelectronics S.r.l.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for strip testing of MEMS devices, testing strip of MEMS dev...
- Patent number 8,748,291
- Issue date Jun 10, 2014
- STMicroelectronics S.r.l.
- Mark Anthony Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including MEMS devices and holed substrates, in p...
- Patent number 8,546,895
- Issue date Oct 1, 2013
- STMicroelectronics S.r.l.
- Mario Cortese
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including MEMS devices and holed substrates, in p...
- Patent number 8,043,881
- Issue date Oct 25, 2011
- STMicroelectronics S.r.l.
- Mario Cortese
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including MEMS devices and holed substrates, in p...
- Patent number 7,875,942
- Issue date Jan 25, 2011
- STMicroelectronics, SRL
- Mario Cortese
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEV...
- Publication number 20130082258
- Publication date Apr 4, 2013
- STMICROELECTRONICS LTD (MALTA)
- Mark Anthony Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER
- Publication number 20130083501
- Publication date Apr 4, 2013
- STMICROELECTRONICS LTD (MALTA)
- Mark A. Azzopardi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
- Publication number 20130028450
- Publication date Jan 31, 2013
- Unimicron Technology Corp.
- Mario Cortese
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS
- Publication number 20120153771
- Publication date Jun 21, 2012
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Device Including MEMS Devices And Holed Substrates, In P...
- Publication number 20120032285
- Publication date Feb 9, 2012
- STMicroelectronics (Malta) Ltd.
- Mario CORTESE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE INCLUDING MEMS DEVICES AND HOLED SUBSTRATES, IN P...
- Publication number 20110081739
- Publication date Apr 7, 2011
- STMicroelectronics S.r.l.
- Mario CORTESE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic device including MEMS devices and holed substrates, in p...
- Publication number 20080179697
- Publication date Jul 31, 2008
- STMicroelectronics S.r.I.
- Mario Cortese
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Mark Anthony Azzopardi

Person

Patents Grantslast 30 patents

Method for soldering a cap to a support layer

Microelectromechanical transducer and corresponding assembly process

Method for strip testing of MEMS devices, testing strip of MEMS dev...

Electronic device including MEMS devices and holed substrates, in p...

Electronic device including MEMS devices and holed substrates, in p...

Electronic device including MEMS devices and holed substrates, in p...

Patents Applicationslast 30 patents

METHOD FOR STRIP TESTING OF MEMS DEVICES, TESTING STRIP OF MEMS DEV...

METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER

LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY

MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS

Electronic Device Including MEMS Devices And Holed Substrates, In P...

ELECTRONIC DEVICE INCLUDING MEMS DEVICES AND HOLED SUBSTRATES, IN P...

Electronic device including MEMS devices and holed substrates, in p...