Mark D. Kellam

Person

Chapel Hill, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump fabrication methods and structures including a titanium...
- Patent number 6,222,279
- Issue date Apr 24, 2001
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated micro-relay modules and methods of fabricating same
- Patent number 6,025,767
- Issue date Feb 15, 2000
- MCNC
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump fabrication methods and structure including a titanium...
- Patent number 5,767,010
- Issue date Jun 16, 1998
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resolution mask programmable via selected by low resolution ph...
- Patent number 5,702,868
- Issue date Dec 30, 1997
- Astarix Inc.
- Mark D. Kellam
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Aluminum-palladium alloy for initiation of electroless plating
- Patent number 5,580,668
- Issue date Dec 3, 1996
- Astarix Inc.
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned charge screen (SACS) field effect transistors and methods
- Patent number 5,536,959
- Issue date Jul 16, 1996
- MCNC
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pleated sheet microelectromechanical transducer
- Patent number 5,479,061
- Issue date Dec 26, 1995
- University of North Carolina
- Stephen M. Bobbio
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electroluminescent display with space charge removal
- Patent number 5,179,316
- Issue date Jan 12, 1993
- MCNC
- Mark D. Kellam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximum areal density recessed oxide isolation (MADROX) process
- Patent number 5,039,625
- Issue date Aug 13, 1991
- MCNC
- Arnold Reisman
- H01 - BASIC ELECTRIC ELEMENTS

Mark D. Kellam

Person

Patents Grantslast 30 patents

Solder bump fabrication methods and structures including a titanium...

Encapsulated micro-relay modules and methods of fabricating same

Solder bump fabrication methods and structure including a titanium...

High resolution mask programmable via selected by low resolution ph...

Aluminum-palladium alloy for initiation of electroless plating

Self-aligned charge screen (SACS) field effect transistors and methods

Pleated sheet microelectromechanical transducer

Electroluminescent display with space charge removal

Maximum areal density recessed oxide isolation (MADROX) process