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Mark E. Tuttle
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Signal delivery in stacked device
Patent number
11,887,969
Issue date
Jan 30, 2024
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
Patent number
11,881,468
Issue date
Jan 23, 2024
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual sided fan-out package having low warpage across all temperatures
Patent number
11,784,166
Issue date
Oct 10, 2023
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a protection mechanism and associated sys...
Patent number
11,756,844
Issue date
Sep 12, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
11,745,281
Issue date
Sep 5, 2023
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stress tuned stiffeners for micro electronics package warpage control
Patent number
11,581,231
Issue date
Feb 14, 2023
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with a card-level thermal regulator mechanism and...
Patent number
11,564,331
Issue date
Jan 24, 2023
Micron Technology, Inc.
Mark E. Tuttle
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
11,410,962
Issue date
Aug 9, 2022
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
11,410,963
Issue date
Aug 9, 2022
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
Patent number
11,309,285
Issue date
Apr 19, 2022
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal delivery in stacked device
Patent number
11,264,360
Issue date
Mar 1, 2022
Micron Technology, Inc.
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual sided fan-out package having low warpage across all temperatures
Patent number
11,239,206
Issue date
Feb 1, 2022
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
Patent number
11,189,588
Issue date
Nov 30, 2021
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of pre-channeled materials for anisotropic conductors
Patent number
11,139,262
Issue date
Oct 5, 2021
Micron Technology, Inc.
Mark E. Tuttle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having electrically and optically conductive...
Patent number
11,069,612
Issue date
Jul 20, 2021
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
11,020,811
Issue date
Jun 1, 2021
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with a protection mechanism and associated sys...
Patent number
10,943,842
Issue date
Mar 9, 2021
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
10,840,210
Issue date
Nov 17, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
10,840,209
Issue date
Nov 17, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with a card-level thermal regulator mechanism and...
Patent number
10,834,853
Issue date
Nov 10, 2020
Micron Technology, Inc.
Mark E. Tuttle
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Semiconductor device structures for burn-in testing and methods the...
Patent number
10,712,382
Issue date
Jul 14, 2020
Micron Technology, Inc.
Mark E. Tuttle
G01 - MEASURING TESTING
Information
Patent Grant
Dual sided fan-out package having low warpage across all temperatures
Patent number
10,714,456
Issue date
Jul 14, 2020
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with a package-level thermal regulator mechanism...
Patent number
10,692,793
Issue date
Jun 23, 2020
Micron Technology, Inc.
Mark E. Tuttle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thrumold post package with reverse build up hybrid additive structure
Patent number
10,593,568
Issue date
Mar 17, 2020
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a protection mechanism and associated sys...
Patent number
10,580,710
Issue date
Mar 3, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having electrically and optically conductive...
Patent number
10,529,659
Issue date
Jan 7, 2020
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal delivery in stacked device
Patent number
10,468,382
Issue date
Nov 5, 2019
Micron Technology, Inc.
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress tuned stiffeners for micro electronics package warpage control
Patent number
10,396,003
Issue date
Aug 27, 2019
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder removal from semiconductor devices
Patent number
10,307,850
Issue date
Jun 4, 2019
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dual sided fan-out package having low warpage across all temperatures
Patent number
10,304,805
Issue date
May 28, 2019
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
Publication number
20240170435
Publication date
May 23, 2024
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20230197669
Publication date
Jun 22, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
Publication number
20220415855
Publication date
Dec 29, 2022
Micron Technology, Inc.
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
Publication number
20220208736
Publication date
Jun 30, 2022
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
Publication number
20220149014
Publication date
May 12, 2022
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
Publication number
20220077098
Publication date
Mar 10, 2022
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
Publication number
20220028820
Publication date
Jan 27, 2022
Micron Technology, Inc.
Mark E. Tuttle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
Publication number
20210252621
Publication date
Aug 19, 2021
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
Publication number
20210183716
Publication date
Jun 17, 2021
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20210091037
Publication date
Mar 25, 2021
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20210074671
Publication date
Mar 11, 2021
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH A CARD-LEVEL THERMAL REGULATOR MECHANISM AND...
Publication number
20210059074
Publication date
Feb 25, 2021
Micron Technology, Inc.
Mark E. Tuttle
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
APPARATUS, METHODS AND SYSTEMS FOR THERMALLY ISOLATED SIGNAL AND PO...
Publication number
20200409438
Publication date
Dec 31, 2020
Micron Technology, Inc.
Mark E. Tuttle
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
Publication number
20200395337
Publication date
Dec 17, 2020
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
Publication number
20200321317
Publication date
Oct 8, 2020
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
Publication number
20200258859
Publication date
Aug 13, 2020
Micron Technology, Inc.
Mark E. Tuttle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20200212000
Publication date
Jul 2, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
Publication number
20200211996
Publication date
Jul 2, 2020
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20200211999
Publication date
Jul 2, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
Publication number
20200168517
Publication date
May 28, 2020
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING ELECTRICALLY AND OPTICALLY CONDUCTIVE...
Publication number
20200126907
Publication date
Apr 23, 2020
Micron Technology, Inc.
Eiichi Nakano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
Publication number
20200058621
Publication date
Feb 20, 2020
Micron Technology, Inc.
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control
Publication number
20190304860
Publication date
Oct 3, 2019
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH A PACKAGE-LEVEL THERMAL REGULATOR MECHANISM...
Publication number
20190273029
Publication date
Sep 5, 2019
Micron Technology, Inc.
Mark E. Tuttle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH A CARD-LEVEL THERMAL REGULATOR MECHANISM AND...
Publication number
20190274232
Publication date
Sep 5, 2019
Micron Technology, Inc.
Mark E. Tuttle
F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information
Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
Publication number
20190247943
Publication date
Aug 15, 2019
Micron Technology, Inc.
Mark E. Tuttle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DUAL SIDED FAN-OUT PACKAGE HAVING LOW WARPAGE ACROSS ALL TEMPERATURES
Publication number
20190237438
Publication date
Aug 1, 2019
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING ELECTRICALLY AND OPTICALLY CONDUCTIVE...
Publication number
20190198443
Publication date
Jun 27, 2019
Micron Technology, Inc.
Eiichi Nakano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURES FOR BURN-IN TESTING AND METHODS THE...
Publication number
20190170811
Publication date
Jun 6, 2019
Micron Technology, Inc.
Mark E. Tuttle
G01 - MEASURING TESTING
Information
Patent Application
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control
Publication number
20190115270
Publication date
Apr 18, 2019
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS