Mark Eskridge

Person

Renton, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Anodically bonded strain isolator
- Patent number 9,187,313
- Issue date Nov 17, 2015
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die mounting stress isolator
- Patent number 8,742,557
- Issue date Jun 3, 2014
- Honeywell International Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Controlled area solder bonding for dies
- Patent number 8,531,040
- Issue date Sep 10, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for platinum ball bonding
- Patent number 8,505,805
- Issue date Aug 13, 2013
- Honeywell International Inc.
- Mark Eskridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for conductive pillars
- Patent number 8,502,327
- Issue date Aug 6, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for reduced stress anchors
- Patent number 8,383,442
- Issue date Feb 26, 2013
- Honeywell International Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods with controlled die bonding areas
- Patent number 8,240,203
- Issue date Aug 14, 2012
- Honeywell International Inc.
- Galen Magendanz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for mounting inertial sensors
- Patent number 8,227,879
- Issue date Jul 24, 2012
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Discrete stress isolator attachment structures for MEMS sensor pack...
- Patent number 8,129,801
- Issue date Mar 6, 2012
- Honeywell International Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for reduced stress anchors
- Patent number 8,039,912
- Issue date Oct 18, 2011
- Honeywell International Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon tab edge mount for a wafer level package
- Patent number 7,932,570
- Issue date Apr 26, 2011
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of assembling micro electromechanical syst...
- Patent number 7,833,829
- Issue date Nov 16, 2010
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanical isolation for MEMS devices
- Patent number 7,830,003
- Issue date Nov 9, 2010
- Honeywell International, Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device seal using liquid crystal polymer
- Patent number 7,420,817
- Issue date Sep 2, 2008
- Honeywell International Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of fabrication of wafer-level vacuum packaged devices
- Patent number 7,402,905
- Issue date Jul 22, 2008
- Honeywell International Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pendulous in-plane MEMS accelerometer device
- Patent number 7,069,784
- Issue date Jul 4, 2006
- Honeywell International Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive pick-off and electrostatic rebalance accelerometer havin...
- Patent number 7,022,543
- Issue date Apr 4, 2006
- Honeywell International, Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Grant
Micro-machined electromechanical system (MEMS) accelerometer device...
- Patent number 6,991,957
- Issue date Jan 31, 2006
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal routing in a hermetically sealed MEMS device
- Patent number 6,949,807
- Issue date Sep 27, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive pick-off and electrostatic rebalance accelerometer havin...
- Patent number 6,935,175
- Issue date Aug 30, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Grant
Out-of-plane compensation suspension for an accelerometer
- Patent number 6,910,379
- Issue date Jun 28, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-machined electromechanical system (MEMS) accelerometer device...
- Patent number 6,897,538
- Issue date May 24, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ANODICALLY BONDED STRAIN ISOLATOR
- Publication number 20130341735
- Publication date Dec 26, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR LIMITING SENSOR MOTION
- Publication number 20130264755
- Publication date Oct 10, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTROLLED AREA SOLDER BONDING FOR DIES
- Publication number 20130241051
- Publication date Sep 19, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR CONDUCTIVE PILLARS
- Publication number 20130193528
- Publication date Aug 1, 2013
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR REDUCED STRESS ANCHORS
- Publication number 20120070931
- Publication date Mar 22, 2012
- Honeywell International Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR MOUNTING INERTIAL SENSORS
- Publication number 20120025332
- Publication date Feb 2, 2012
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON TAB EDGE MOUNT FOR A WAFER LEVEL PACKAGE
- Publication number 20110108935
- Publication date May 12, 2011
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUSPENDED LEAD FRAME ELECTRONIC PACKAGE
- Publication number 20110042137
- Publication date Feb 24, 2011
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRU...
- Publication number 20100255622
- Publication date Oct 7, 2010
- Honeywell International, Inc.
- Mark Eskridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICES AND METHODS WITH CONTROLLED DIE BONDING AREAS
- Publication number 20100147075
- Publication date Jun 17, 2010
- Honeywell International Inc.
- Galen Magendanz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYST...
- Publication number 20100105167
- Publication date Apr 29, 2010
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PLATINUM BALL BONDING
- Publication number 20100092795
- Publication date Apr 15, 2010
- Honeywell International Inc.
- Mark Eskridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR REDUCED STRESS ANCHORS
- Publication number 20090321857
- Publication date Dec 31, 2009
- Honeywell International Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL ISOLATION FOR MEMS DEVICES
- Publication number 20090166827
- Publication date Jul 2, 2009
- Honeywell International, Inc.
- Michael Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE MOUNTING STRESS ISOLATOR
- Publication number 20080315397
- Publication date Dec 25, 2008
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FABRICATION OF WAFER-LEVEL VACUUM PACKAGED DEVICES
- Publication number 20080029863
- Publication date Feb 7, 2008
- Honeywell International Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Discrete stress isolator
- Publication number 20070170525
- Publication date Jul 26, 2007
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device seal using liquid crystal polymer
- Publication number 20070159803
- Publication date Jul 12, 2007
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PENDULOUS IN-PLANE MEMS ACCELEROMETER DEVICE
- Publication number 20060137450
- Publication date Jun 29, 2006
- Honeywell International, Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Application
Flip chip bonded micro-electromechanical system (MEMS) device
- Publication number 20050205951
- Publication date Sep 22, 2005
- Honeywell Internatioanl, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MACHINED ELECTROMECHANICAL SYSTEM (MEMS) ACCELEROMETER DEVICE...
- Publication number 20050202585
- Publication date Sep 15, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Signal routing in a hermetically sealed MEMS device
- Publication number 20050139967
- Publication date Jun 30, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive pick-off and electrostatic rebalance accelerometer havin...
- Publication number 20050139942
- Publication date Jun 30, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Application
Capacitive pick-off and electrostatic rebalance accelerometer havin...
- Publication number 20050109109
- Publication date May 26, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- G01 - MEASURING TESTING
Information Patent Application
OUT-OF-PLANE COMPENSATION SUSPENSION FOR AN ACCELEROMETER
- Publication number 20050092107
- Publication date May 5, 2005
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-machined electromechanical system (MEMS) accelerometer device...
- Publication number 20030036214
- Publication date Feb 20, 2003
- Honeywell International, Inc.
- Mark H. Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Mark Eskridge

Person

Patents Grantslast 30 patents

Anodically bonded strain isolator

Die mounting stress isolator

Controlled area solder bonding for dies

Systems and methods for platinum ball bonding

Systems and methods for conductive pillars

Methods for reduced stress anchors

MEMS devices and methods with controlled die bonding areas

Systems and methods for mounting inertial sensors

Discrete stress isolator attachment structures for MEMS sensor pack...

Systems and methods for reduced stress anchors

Silicon tab edge mount for a wafer level package

MEMS devices and methods of assembling micro electromechanical syst...

Mechanical isolation for MEMS devices

MEMS device seal using liquid crystal polymer

Methods of fabrication of wafer-level vacuum packaged devices

Pendulous in-plane MEMS accelerometer device

Capacitive pick-off and electrostatic rebalance accelerometer havin...

Micro-machined electromechanical system (MEMS) accelerometer device...

Signal routing in a hermetically sealed MEMS device

Capacitive pick-off and electrostatic rebalance accelerometer havin...

Out-of-plane compensation suspension for an accelerometer

Micro-machined electromechanical system (MEMS) accelerometer device...

Patents Applicationslast 30 patents

ANODICALLY BONDED STRAIN ISOLATOR

METHODS AND SYSTEMS FOR LIMITING SENSOR MOTION

CONTROLLED AREA SOLDER BONDING FOR DIES

SYSTEMS AND METHODS FOR CONDUCTIVE PILLARS

METHODS FOR REDUCED STRESS ANCHORS

SYSTEMS AND METHODS FOR MOUNTING INERTIAL SENSORS

SILICON TAB EDGE MOUNT FOR A WAFER LEVEL PACKAGE

SUSPENDED LEAD FRAME ELECTRONIC PACKAGE

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRU...

MEMS DEVICES AND METHODS WITH CONTROLLED DIE BONDING AREAS

MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYST...

SYSTEMS AND METHODS FOR PLATINUM BALL BONDING

SYSTEMS AND METHODS FOR REDUCED STRESS ANCHORS

MECHANICAL ISOLATION FOR MEMS DEVICES

DIE MOUNTING STRESS ISOLATOR

METHODS OF FABRICATION OF WAFER-LEVEL VACUUM PACKAGED DEVICES

Discrete stress isolator

MEMS device seal using liquid crystal polymer

PENDULOUS IN-PLANE MEMS ACCELEROMETER DEVICE

Flip chip bonded micro-electromechanical system (MEMS) device

MICRO-MACHINED ELECTROMECHANICAL SYSTEM (MEMS) ACCELEROMETER DEVICE...

Signal routing in a hermetically sealed MEMS device

Capacitive pick-off and electrostatic rebalance accelerometer havin...

Capacitive pick-off and electrostatic rebalance accelerometer havin...

OUT-OF-PLANE COMPENSATION SUSPENSION FOR AN ACCELEROMETER

Micro-machined electromechanical system (MEMS) accelerometer device...