Mark G. Courtney

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,858,111
- Issue date Feb 22, 2005
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,333,104
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates and process
- Patent number 5,881,945
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer solder seal band for semiconductor substrates
- Patent number 5,881,944
- Issue date Mar 16, 1999
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling of chips using blind holes with customized depth
- Patent number 5,819,402
- Issue date Oct 13, 1998
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling of chips using blind holes with customized depth
- Patent number 5,757,620
- Issue date May 26, 1998
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cooling of chips using a plurality of cust...
- Patent number 5,724,729
- Issue date Mar 10, 1998
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cooling of chips using a plurality of customized ther...
- Patent number 5,623,394
- Issue date Apr 22, 1997
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cooling of chips using a plurality of materials
- Patent number 5,604,978
- Issue date Feb 25, 1997
- International Business Machines Corporation
- Raed A. Sherif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmentally secure and thermally efficient heat sink assembly
- Patent number 4,715,430
- Issue date Dec 29, 1987
- International Business Machines Corporation
- Allen J. Arnold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive polymer interconnection configurations
- Publication number 20020028327
- Publication date Mar 7, 2002
- Charles H. Perry
- H01 - BASIC ELECTRIC ELEMENTS

Mark G. Courtney

Person

Patents Grantslast 30 patents

Conductive polymer interconnection configurations

Conductive polymer interconnection configurations

Electrical interconnection package and method thereof

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Solder disc connection

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Multi-layer solder seal band for semiconductor substrates and process

Multi-layer solder seal band for semiconductor substrates

Method for cooling of chips using blind holes with customized depth

Apparatus for cooling of chips using blind holes with customized depth

Method and apparatus for cooling of chips using a plurality of cust...

Apparatus for cooling of chips using a plurality of customized ther...

Method for cooling of chips using a plurality of materials

Environmentally secure and thermally efficient heat sink assembly

Patents Applicationslast 30 patents

Conductive polymer interconnection configurations