Mark Hiatt

Person

Eagle, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,264,360
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 10,468,382
- Issue date Nov 5, 2019
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 9,324,690
- Issue date Apr 26, 2016
- Micron Technology, Inc.
- Brent Keeth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor substrates comprising through substrate interconnects...
- Patent number 8,531,046
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Dave Pratt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Signal delivery in stacked device
- Patent number 8,106,520
- Issue date Jan 31, 2012
- Micron Technology, Inc.
- Brent Keeth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of determining x-y spatial orientation of a semiconductor s...
- Patent number 7,955,946
- Issue date Jun 7, 2011
- Micron Technology, Inc.
- Dave Pratt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,956,443
- Issue date Jun 7, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,300,857
- Issue date Nov 27, 2007
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration and a method for reducing contamination with particle...
- Patent number 6,881,264
- Issue date Apr 19, 2005
- Infineon Technologies AG
- Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20220415855
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20200058621
- Publication date Feb 20, 2020
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20160240515
- Publication date Aug 18, 2016
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20130036606
- Publication date Feb 14, 2013
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20110233777
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Determining X-Y Spatial Orientation of a Semiconductor S...
- Publication number 20110204526
- Publication date Aug 25, 2011
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20100171217
- Publication date Jul 8, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20100059898
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20080111213
- Publication date May 15, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of determining x-y spatial orientation of a semiconductor s...
- Publication number 20070269994
- Publication date Nov 22, 2007
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-wafer interconnects for photoimager and memory wafers
- Publication number 20060043599
- Publication date Mar 2, 2006
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration and a method for reducing contamination with particle...
- Publication number 20040154530
- Publication date Aug 12, 2004
- Mark Hiatt
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Signal delivery in stacked device

Signal delivery in stacked device

Signal delivery in stacked device

Signal delivery in stacked device

Semiconductor substrates comprising through substrate interconnects...

Signal delivery in stacked device

Methods of determining x-y spatial orientation of a semiconductor s...

Through-wafer interconnects for photoimager and memory wafers

Through-wafer interconnects for photoimager and memory wafers

Configuration and a method for reducing contamination with particle...

Patents Applicationslast 30 patents

SIGNAL DELIVERY IN STACKED DEVICE

SIGNAL DELIVERY IN STACKED DEVICE

SIGNAL DELIVERY IN STACKED DEVICE

SIGNAL DELIVERY IN STACKED DEVICE

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

Methods of Determining X-Y Spatial Orientation of a Semiconductor S...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

SIGNAL DELIVERY IN STACKED DEVICE

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

Methods of determining x-y spatial orientation of a semiconductor s...

Through-wafer interconnects for photoimager and memory wafers

Configuration and a method for reducing contamination with particle...