Mark K. Hoffmeyer

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 12,016,127
- Issue date Jun 18, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applying a solderable surface to conductive ink
- Patent number 11,805,603
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,751,369
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material structures for directing heat in a three...
- Patent number 11,703,922
- Issue date Jul 18, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit module with a structurally balanced package usin...
- Patent number 11,664,302
- Issue date May 30, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,456,548
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material structures for directing heat in a three...
- Patent number 11,416,045
- Issue date Aug 16, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 11,404,287
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,310,950
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array electrical contact coating
- Patent number 11,289,836
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Kevin O'Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,278,977
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a component to a substrate by adhesion to an oxidized so...
- Patent number 11,228,124
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials with radiative coupling heat transfer
- Patent number 11,198,807
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Anil Yuksel
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated circuit module with a structurally balanced package usin...
- Patent number 11,195,789
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent sensors with liquid crystal polymer layers
- Patent number 11,122,682
- Issue date Sep 14, 2021
- International Business Machines Corporation
- James A. Busby
- G01 - MEASURING TESTING
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material structures
- Patent number 11,013,147
- Issue date May 18, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer system with modified module socket
- Patent number 10,993,324
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 10,978,313
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Implementing reworkable strain relief packaging structure for elect...
- Patent number 10,834,811
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beveling staggered card edges
- Patent number 10,804,629
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Sandra Shirk/Heath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device assembly
- Patent number 10,779,391
- Issue date Sep 15, 2020
- International Business Machines Corporation
- David Barron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient placement of grid array components
- Patent number 10,756,009
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material structures
- Patent number 10,653,037
- Issue date May 12, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive-bonded thermal interface structures
- Patent number 10,607,859
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive-bonded thermal interface structures
- Patent number 10,319,609
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive-bonded thermal interface structures
- Patent number 10,304,699
- Issue date May 28, 2019
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive-bonded thermal interface structures for integrated circuit...
- Patent number 10,236,189
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material structures
- Patent number 10,182,514
- Issue date Jan 15, 2019
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LOW-CURRENT VOLTAGE SOURCE WATCHDOG
- Publication number 20240097292
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20240057266
- Publication date Feb 15, 2024
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoff And Support Structures for Reliable Land Grid Array and Hy...
- Publication number 20240008208
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20230371221
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20230015176
- Publication date Jan 19, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE...
- Publication number 20220334625
- Publication date Oct 20, 2022
- International Business Machines Corporation
- MARK K. HOFFMEYER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20220232746
- Publication date Jul 21, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAND GRID ARRAY ELECTRICAL CONTACT COATING
- Publication number 20220029326
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Kevin O'Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE...
- Publication number 20210318734
- Publication date Oct 14, 2021
- International Business Machines Corporation
- MARK K. HOFFMEYER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210114126
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210120713
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20210111037
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH A STRUCTURALLY BALANCED PACKAGE USIN...
- Publication number 20210111112
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIALS WITH RADIATIVE COUPLING HEAT TRANSFER
- Publication number 20210087450
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Anil Yuksel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20210083410
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET
- Publication number 20200412045
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI LAYER THERMAL INTERFACE MATERIAL
- Publication number 20200411411
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK
- Publication number 20200404795
- Publication date Dec 24, 2020
- International Business Machines Corporation
- MARK K. HOFFMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL STRUCTURES
- Publication number 20200221602
- Publication date Jul 9, 2020
- MARK K. HOFFMEYER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH A STRUCTURALLY BALANCED PACKAGE USIN...
- Publication number 20200176368
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-RESPONDENT SENSORS WITH LIQUID CRYSTAL POLYMER LAYERS
- Publication number 20190313526
- Publication date Oct 10, 2019
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES
- Publication number 20190267253
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES
- Publication number 20190267254
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20190259632
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
BEVELING STAGGERED CARD EDGES
- Publication number 20190165505
- Publication date May 30, 2019
- International Business Machines Corporation
- Sandra Shirk/Heath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL STRUCTURES
- Publication number 20190116686
- Publication date Apr 18, 2019
- International Business Machines Corporation
- MARK K. HOFFMEYER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES
- Publication number 20180374716
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT...
- Publication number 20180374715
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES
- Publication number 20180374714
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Karl Stathakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20180328980
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING

Mark K. Hoffmeyer

Person

Patents Grantslast 30 patents

Liquid metal infiltration rework of electronic assembly

Applying a solderable surface to conductive ink

Reliability enhancement of press fit connectors

Liquid metal infiltration rework of electronic assembly

Thermal interface material structures for directing heat in a three...

Integrated circuit module with a structurally balanced package usin...

Reliability enhancement of press fit connectors

Thermal interface material structures for directing heat in a three...

Fixture facilitating heat sink fabrication

Liquid metal infiltration rework of electronic assembly

Land grid array electrical contact coating

Liquid metal infiltration rework of electronic assembly

Connecting a component to a substrate by adhesion to an oxidized so...

Thermal interface materials with radiative coupling heat transfer

Integrated circuit module with a structurally balanced package usin...

Tamper-respondent sensors with liquid crystal polymer layers

Multi layer thermal interface material

Thermal interface material structures

Computer system with modified module socket

Fixture facilitating heat sink fabrication

Implementing reworkable strain relief packaging structure for elect...

Beveling staggered card edges

Integrated circuit device assembly

Efficient placement of grid array components

Thermal interface material structures

Adhesive-bonded thermal interface structures

Adhesive-bonded thermal interface structures

Adhesive-bonded thermal interface structures

Adhesive-bonded thermal interface structures for integrated circuit...

Thermal interface material structures

Patents Applicationslast 30 patents

LOW-CURRENT VOLTAGE SOURCE WATCHDOG

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

Standoff And Support Structures for Reliable Land Grid Array and Hy...

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE...

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

LAND GRID ARRAY ELECTRICAL CONTACT COATING

THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE...

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

FIXTURE FACILITATING HEAT SINK FABRICATION

INTEGRATED CIRCUIT MODULE WITH A STRUCTURALLY BALANCED PACKAGE USIN...

THERMAL INTERFACE MATERIALS WITH RADIATIVE COUPLING HEAT TRANSFER

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET

MULTI LAYER THERMAL INTERFACE MATERIAL

APPLYING A SOLDERABLE SURFACE TO CONDUCTIVE INK

THERMAL INTERFACE MATERIAL STRUCTURES

INTEGRATED CIRCUIT MODULE WITH A STRUCTURALLY BALANCED PACKAGE USIN...

TAMPER-RESPONDENT SENSORS WITH LIQUID CRYSTAL POLYMER LAYERS

ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES

ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES

FIXTURE FACILITATING HEAT SINK FABRICATION

BEVELING STAGGERED CARD EDGES

THERMAL INTERFACE MATERIAL STRUCTURES

ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES

ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES FOR INTEGRATED CIRCUIT...

ADHESIVE-BONDED THERMAL INTERFACE STRUCTURES

TESTING PRINTED CIRCUIT BOARD ASSEMBLY