Mark V. Pierson

Person

Lynn, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Recyclable and dispensable cutlery utensil
- Patent number 11,083,316
- Issue date Aug 10, 2021
- Waddington North America, Inc.
- Mark V. Pierson
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
No touch utensil dispenser
- Patent number 10,820,722
- Issue date Nov 3, 2020
- Waddington North America, Inc.
- Mark V. Pierson
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Toothpaste dispenser
- Patent number 9,211,558
- Issue date Dec 15, 2015
- Mark V. Pierson
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
No touch utensil dispenser
- Patent number 8,272,533
- Issue date Sep 25, 2012
- Anthony D'Amelia
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 8,089,133
- Issue date Jan 3, 2012
- International Business Machines Corporation
- Dinesh Gupta
- G02 - OPTICS
Information Patent Grant
Z interconnect structure and method
- Patent number 7,718,902
- Issue date May 18, 2010
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formable structure between two objects
- Patent number 7,335,325
- Issue date Feb 26, 2008
- Mark Vincent Pierson
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
System and method for capturing contaminants within a disk drive
- Patent number 6,980,392
- Issue date Dec 27, 2005
- International Business Machines Corporation
- Mark V. Pierson
- G11 - INFORMATION STORAGE
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,955,982
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making and using a floating interposer
- Patent number 6,946,329
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Mark Vincent Pierson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical communication assembly
- Patent number 6,922,294
- Issue date Jul 26, 2005
- International Business Machines Corporation
- Mark V. Pierson
- G02 - OPTICS
Information Patent Grant
Fiber optic attachment method, structure, and system
- Patent number 6,917,728
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Michael S. Lemmon
- G02 - OPTICS
Information Patent Grant
Optical assemblies for transmitting and manipulating optical beams
- Patent number 6,836,015
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Monty M. Denneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z interconnect structure and method
- Patent number 6,805,280
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Floating interposer
- Patent number 6,774,315
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Mark Vincent Pierson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel structure with plurality of chip compartments for providing h...
- Patent number 6,774,472
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Mark V. Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,770,968
- Issue date Aug 3, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems interconnected by bumps of joining material
- Patent number 6,759,738
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Kenneth Michael Fallon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,756,680
- Issue date Jun 29, 2004
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,719,871
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming solder connections on a circuitized substrate
- Patent number 6,708,871
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Mark Vincent Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical coupling of a stiffener to a chip carrier
- Patent number 6,699,736
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Terry J. Dornbos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low or no-force bump flattening structure and method
- Patent number 6,674,647
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Mark V. Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,664,637
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Common heatsink for multiple chips and modules
- Patent number 6,661,661
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LCD cover optical structure and method
- Patent number 6,639,638
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- G02 - OPTICS
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,576,996
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Panel structure with plurality of chip compartments for providing h...
- Patent number 6,569,710
- Issue date May 27, 2003
- International Business Machines Corporation
- Mark V. Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,559,666
- Issue date May 6, 2003
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Electrical coupling of a stiffener to a chip carrier
- Patent number 6,534,848
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Terry J. Dornbos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RECYCLABLE AND DISPENSABLE CUTLERY UTENSIL
- Publication number 20210315399
- Publication date Oct 14, 2021
- Waddington North America, Inc.
- Mark V. Pierson
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
NO TOUCH UTENSIL DISPENSER
- Publication number 20190075940
- Publication date Mar 14, 2019
- Waddington North America, Inc.
- Mark V. Pierson
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
Optical assemblies for transmitting and manipulating optical beams
- Publication number 20050078376
- Publication date Apr 14, 2005
- Dinesh Gupta
- G02 - OPTICS
Information Patent Application
Z interconnect structure and method
- Publication number 20050051608
- Publication date Mar 10, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fiber optic attachment method, structure, and system
- Publication number 20040264861
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Michael S. Lemmon
- G02 - OPTICS
Information Patent Application
Optical communication assembly
- Publication number 20040218288
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Mark V. Pierson
- G02 - OPTICS
Information Patent Application
OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS
- Publication number 20040217464
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Monty M. Denneau
- G02 - OPTICS
Information Patent Application
Floating interposer
- Publication number 20040201396
- Publication date Oct 14, 2004
- Mark Vincent Pierson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for capturing contaminants within a disk drive
- Publication number 20040201917
- Publication date Oct 14, 2004
- International Business Machines Corporation
- Mark V. Pierson
- G11 - INFORMATION STORAGE
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20040094842
- Publication date May 20, 2004
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Z interconnect structure and method
- Publication number 20030127247
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Common heatsink for multiple chips and modules
- Publication number 20030128518
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming solder connections on a circuitized substrate
- Publication number 20030127500
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Mark Vincent Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low or no-force bump flattening structure and method
- Publication number 20030127499
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Mark V. Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20030123229
- Publication date Jul 3, 2003
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electrical coupling of a stiffener to a chip carrier
- Publication number 20030082853
- Publication date May 1, 2003
- Terry J. Dornbos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Panel structure with plurality of chip compartments for providing h...
- Publication number 20030017648
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Mark V. Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board construction
- Publication number 20020166697
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Mark L. Janecek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method of making a CTE compensated chip interposer
- Publication number 20020088116
- Publication date Jul 11, 2002
- International Business Machines Corporation
- Cynthia Susan Milkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for printed circuit board repair
- Publication number 20020059721
- Publication date May 23, 2002
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20020046804
- Publication date Apr 25, 2002
- THOMAS M. CULNANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20020005245
- Publication date Jan 17, 2002
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of making electrically conductive contacts on substrates
- Publication number 20020000462
- Publication date Jan 3, 2002
- Donald I. Mead
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for semiconductor testing using electrically cond...
- Publication number 20010035759
- Publication date Nov 1, 2001
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES
- Publication number 20010024127
- Publication date Sep 27, 2001
- WILLIAM E. BERNIER
- G01 - MEASURING TESTING
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010018230
- Publication date Aug 30, 2001
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for reinforcing a semiconductor device to prev...
- Publication number 20010009277
- Publication date Jul 26, 2001
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010005047
- Publication date Jun 28, 2001
- Miguel Angel Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rolling ball connector
- Publication number 20010002330
- Publication date May 31, 2001
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20010001183
- Publication date May 17, 2001
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Mark V. Pierson

Person

Patents Grantslast 30 patents

Recyclable and dispensable cutlery utensil

No touch utensil dispenser

Toothpaste dispenser

No touch utensil dispenser

Optical assemblies for transmitting and manipulating optical beams

Z interconnect structure and method

Formable structure between two objects

System and method for capturing contaminants within a disk drive

Flip chip C4 extension structure and process

Methods of making and using a floating interposer

Optical communication assembly

Fiber optic attachment method, structure, and system

Optical assemblies for transmitting and manipulating optical beams

Z interconnect structure and method

Floating interposer

Panel structure with plurality of chip compartments for providing h...

Method for bonding heat sinks to overmolds and device formed thereby

Systems interconnected by bumps of joining material

Flip chip C4 extension structure and process

Method for bonding heat sinks to overmolds and device formed thereby

Method for forming solder connections on a circuitized substrate

Electrical coupling of a stiffener to a chip carrier

Low or no-force bump flattening structure and method

Flip chip C4 extension structure and process

Common heatsink for multiple chips and modules

LCD cover optical structure and method

Method for bonding heat sinks to overmolds and device formed thereby

Panel structure with plurality of chip compartments for providing h...

Method and device for semiconductor testing using electrically cond...

Electrical coupling of a stiffener to a chip carrier

Patents Applicationslast 30 patents

RECYCLABLE AND DISPENSABLE CUTLERY UTENSIL

NO TOUCH UTENSIL DISPENSER

Optical assemblies for transmitting and manipulating optical beams

Z interconnect structure and method

Fiber optic attachment method, structure, and system

Optical communication assembly

OPTICAL ASSEMBLIES FOR TRANSMITTING AND MANIPULATING OPTICAL BEAMS

Floating interposer

System and method for capturing contaminants within a disk drive

Flip chip C4 extension structure and process

Z interconnect structure and method

Common heatsink for multiple chips and modules

Method for forming solder connections on a circuitized substrate

Low or no-force bump flattening structure and method

Method for bonding heat sinks to overmolds and device formed thereby

Electrical coupling of a stiffener to a chip carrier

Panel structure with plurality of chip compartments for providing h...

Circuit board construction

Method of making a CTE compensated chip interposer

Apparatus and method for printed circuit board repair

PROCESS FOR MAKING SEMICONDUCTOR CHIP ASSEMBLY

Method for bonding heat sinks to overmolds and device formed thereby

Method of making electrically conductive contacts on substrates

Method and device for semiconductor testing using electrically cond...

SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES

Flip chip C4 extension structure and process

Structure and method for reinforcing a semiconductor device to prev...

Flip chip C4 extension structure and process

Rolling ball connector

Method for bonding heat sinks to overmolds and device formed thereby