Mark Vandermeulen

Person

Burlington, CA

People

Patents Grantslast 30 patents

Information Patent Grant
High density semiconductor package and related methods
- Patent number 10,468,336
- Issue date Nov 5, 2019
- Semiconductor Components Industries, LLC
- Joseph S. Steffler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multi-level thin film capacitor
- Patent number 9,305,709
- Issue date Apr 5, 2016
- BlackBerry Limited
- Ivoyl Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level thin film capacitor on a ceramic substrate and method o...
- Patent number 8,883,606
- Issue date Nov 11, 2014
- BlackBerry Limited
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level thin film capacitor on a ceramic substrate and method o...
- Patent number 8,569,142
- Issue date Oct 29, 2013
- BlackBerry Limited
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level thin film capacitor on a ceramic substrate and method o...
- Patent number 7,875,956
- Issue date Jan 25, 2011
- Paratek Microwave, Inc.
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for a tilted optical receiver assembly
- Patent number 7,566,866
- Issue date Jul 28, 2009
- Gennum Corporation
- Mark Vandermeulen
- G01 - MEASURING TESTING
Information Patent Grant
Multi-level thin film capacitor on a ceramic substrate
- Patent number 7,224,040
- Issue date May 29, 2007
- Gennum Corporation
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Perimeter anchored thick film pad
- Patent number 6,583,019
- Issue date Jun 24, 2003
- Gennum Corporation
- Mark Vandermeulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170345745
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Joseph S. STEFFLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...
- Publication number 20150093497
- Publication date Apr 2, 2015
- BlackBerry Limited
- Ivoyl Koutsaroff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...
- Publication number 20140037835
- Publication date Feb 6, 2014
- BlackBerry Limited
- Ivoyl P. Koutsaroff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHIP WITH CAVITY
- Publication number 20090087010
- Publication date Apr 2, 2009
- Mark Vandermeulen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY
- Publication number 20090065678
- Publication date Mar 12, 2009
- Mark Vandermeulen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method o...
- Publication number 20080037200
- Publication date Feb 14, 2008
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...
- Publication number 20070209201
- Publication date Sep 13, 2007
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-level thin film capacitor on a ceramic substrate and method o...
- Publication number 20050117272
- Publication date Jun 2, 2005
- Gennum Corporation
- Ivoyl P. Koutsaroff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERIMETER ANCHORED THICK FILM PAD
- Publication number 20030096493
- Publication date May 22, 2003
- Mark Vandermeulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mark Vandermeulen

Person

Patents Grantslast 30 patents

High density semiconductor package and related methods

Method of forming a multi-level thin film capacitor

Multi-level thin film capacitor on a ceramic substrate and method o...

Multi-level thin film capacitor on a ceramic substrate and method o...

Multi-level thin film capacitor on a ceramic substrate and method o...

Systems and methods for a tilted optical receiver assembly

Multi-level thin film capacitor on a ceramic substrate

Perimeter anchored thick film pad

Patents Applicationslast 30 patents

HIGH DENSITY SEMICONDUCTOR PACKAGE AND RELATED METHODS

MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...

MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...

CARRIER CHIP WITH CAVITY

SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY

Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method o...

MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD O...

Multi-level thin film capacitor on a ceramic substrate and method o...

PERIMETER ANCHORED THICK FILM PAD