Markus Lutz

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator with colocated temperature sensor
- Patent number 12,095,447
- Issue date Sep 17, 2024
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator with beam segments having predefined angular offset...
- Patent number 11,897,757
- Issue date Feb 13, 2024
- SiTime Corporation
- Renata M. Berger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Time module apparatus for use with fixed-beacon time transfer system
- Patent number 11,871,369
- Issue date Jan 9, 2024
- SiTime Corporation
- Markus Lutz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-die integrated circuit package
- Patent number 11,807,518
- Issue date Nov 7, 2023
- SiTime Corporation
- Renata M. Berger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator with co-located temperature sensor
- Patent number 11,770,112
- Issue date Sep 26, 2023
- SiTime Corporation
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,374,535
- Issue date Jun 28, 2022
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fixed-beacon time transfer system
- Patent number 11,218,984
- Issue date Jan 4, 2022
- SiTime Corporation
- Markus Lutz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frequency compensated oscillator design for process tolerances
- Patent number 11,146,228
- Issue date Oct 12, 2021
- Robert Bosch GmbH
- Markus Lutz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing of integrated circuit resonator
- Patent number 10,913,655
- Issue date Feb 9, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure for micromechanical resonator
- Patent number 10,723,617
- Issue date Jul 28, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-resonator semiconductor die
- Patent number 10,476,477
- Issue date Nov 12, 2019
- SiTime Corporation
- Charles I. Grosjean
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frequency compensated oscillator design for process tolerances
- Patent number 10,439,579
- Issue date Oct 8, 2019
- Robert Bosch GmbH
- Markus Lutz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 10,287,162
- Issue date May 14, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,099,917
- Issue date Oct 16, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frequency compensated oscillator design for process tolerances
- Patent number 9,985,598
- Issue date May 29, 2018
- Robert Bosch GmbH
- Markus Lutz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked-die MEMS resonator system
- Patent number 9,821,998
- Issue date Nov 21, 2017
- SiTime Corpoaration
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frequency compensated oscillator design for process tolerances
- Patent number 9,800,222
- Issue date Oct 24, 2017
- Robert Bosch GmbH
- Markus Lutz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electromechanical system having a controlled atmosphere, and method...
- Patent number 9,771,257
- Issue date Sep 26, 2017
- Robert Bosch GmbH
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laterally-doped MEMS resonator
- Patent number 9,774,313
- Issue date Sep 26, 2017
- SiTime Corporation
- Charles I. Grosjean
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,758,371
- Issue date Sep 12, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temperature insensitive resonant elements and oscillators and metho...
- Patent number 9,695,036
- Issue date Jul 4, 2017
- SiTime Corporation
- Renata Melamud Berger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,440,845
- Issue date Sep 13, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer encapsulated microelectromechanical structure
- Patent number 9,434,608
- Issue date Sep 6, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Suspension for Resonators and MEMS Devices
- Publication number 20250011162
- Publication date Jan 9, 2025
- SiTime Corporation
- Nicholas MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ovenized MEMS
- Publication number 20250007455
- Publication date Jan 2, 2025
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectromechanical System Oven-Controlled Oscillator
- Publication number 20240186947
- Publication date Jun 6, 2024
- SiTime Corporation
- Carl Martin Arft
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Non-Lid-Bonded MEMS Resonator With Phosphorus Dopant
- Publication number 20240056054
- Publication date Feb 15, 2024
- SiTime Corporation
- Charles I. Grosjean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVENIZED MEMS
- Publication number 20220360218
- Publication date Nov 10, 2022
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20200385261
- Publication date Dec 10, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVENIZED MEMS
- Publication number 20200186084
- Publication date Jun 11, 2020
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure For Micromechanical Resonator
- Publication number 20190292043
- Publication date Sep 26, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20190055121
- Publication date Feb 21, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES
- Publication number 20180248532
- Publication date Aug 30, 2018
- ROBERT BOSCH GmbH
- Markus Lutz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES
- Publication number 20180248533
- Publication date Aug 30, 2018
- ROBERT BOSCH GmbH
- Markus Lutz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20180155186
- Publication date Jun 7, 2018
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20180044176
- Publication date Feb 15, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20170101310
- Publication date Apr 13, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL RESONATOR
- Publication number 20170093361
- Publication date Mar 30, 2017
- SiTime Corporation
- Charles I. Grosjean
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20170029269
- Publication date Feb 2, 2017
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20160167950
- Publication date Jun 16, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES
- Publication number 20150263699
- Publication date Sep 17, 2015
- ROBERT BOSCH GmbH
- Markus LUTZ
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES
- Publication number 20150263695
- Publication date Sep 17, 2015
- ROBERT BOSCH GmbH
- Markus LUTZ
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20150123220
- Publication date May 7, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20150041928
- Publication date Feb 12, 2015
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM
- Publication number 20150035090
- Publication date Feb 5, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED GETTER AREA FOR WAFER LEVEL ENCAPSULATED MICROELECTROMEC...
- Publication number 20130285162
- Publication date Oct 31, 2013
- ROBERT BOSCH GmbH
- Markus Lutz
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Markus Lutz

Person

Patents Grantslast 30 patents

MEMS resonator with colocated temperature sensor

MEMS resonator system

Ovenized MEMS

MEMS resonator with beam segments having predefined angular offset...

Time module apparatus for use with fixed-beacon time transfer system

Multi-die integrated circuit package

MEMS resonator with co-located temperature sensor

Stacked-die MEMS resonator

Microelectromechanical structure with bonded cover

Stacked-die MEMS resonator

Ovenized MEMS

Fixed-beacon time transfer system

Frequency compensated oscillator design for process tolerances

Manufacturing of integrated circuit resonator

Encapsulated microelectromechanical structure

Package structure for micromechanical resonator

Dual-resonator semiconductor die

Encapsulated microelectromechanical structure

Frequency compensated oscillator design for process tolerances

Low-profile stacked-die MEMS resonator system

Encapsulated microelectromechanical structure

Frequency compensated oscillator design for process tolerances

Stacked-die MEMS resonator system

Frequency compensated oscillator design for process tolerances

Electromechanical system having a controlled atmosphere, and method...

Laterally-doped MEMS resonator

Encapsulated microelectromechanical structure

Temperature insensitive resonant elements and oscillators and metho...

Encapsulated microelectromechanical structure

Wafer encapsulated microelectromechanical structure

Patents Applicationslast 30 patents

STACKED-DIE MEMS RESONATOR

Suspension for Resonators and MEMS Devices

Ovenized MEMS

Microelectromechanical System Oven-Controlled Oscillator

Non-Lid-Bonded MEMS Resonator With Phosphorus Dopant

MICROMECHANICAL STRUCTURE WITH BONDED COVER

STACKED-DIE MEMS RESONATOR

STACKED-DIE MEMS RESONATOR

OVENIZED MEMS

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

STACKED-DIE MEMS RESONATOR

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

OVENIZED MEMS

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Package Structure For Micromechanical Resonator

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES

FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

MICROELECTROMECHANICAL RESONATOR

STACKED-DIE MEMS RESONATOR SYSTEM

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES

FREQUENCY COMPENSATED OSCILLATOR DESIGN FOR PROCESS TOLERANCES

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM

INTEGRATED GETTER AREA FOR WAFER LEVEL ENCAPSULATED MICROELECTROMEC...