Martin Gruber

Person

Schwandorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including electrical redistribution layers o...
- Patent number 12,154,886
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling trapped ions and method of manufacturing the...
- Patent number 11,984,416
- Issue date May 14, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module including a semiconductor package connected to a...
- Patent number 11,955,407
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with elevated lead and structure extending vertically from...
- Patent number 11,862,582
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection lug
- Patent number 11,728,250
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with signal distribution element
- Patent number 11,721,616
- Issue date Aug 8, 2023
- Infineon Technologies Austria AG
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming a semiconductor package
- Patent number 11,715,719
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with separate substrate sections
- Patent number 11,710,684
- Issue date Jul 25, 2023
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistor packages with exposed source and drain cont...
- Patent number 11,600,558
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of one or more carrier bodies and electronic components...
- Patent number 11,502,042
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic current sensor
- Patent number 10,989,742
- Issue date Apr 27, 2021
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package having multiple mold compounds
- Patent number 10,685,909
- Issue date Jun 16, 2020
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package with electrical interposer
- Patent number 10,629,575
- Issue date Apr 21, 2020
- Infineon Techologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a plurality of encapsulation layers an...
- Patent number 10,418,313
- Issue date Sep 17, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having die pads with exposed surfaces
- Patent number 10,373,895
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS
- Publication number 20240213193
- Publication date Jun 27, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...
- Publication number 20240194566
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20240113026
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...
- Publication number 20230402423
- Publication date Dec 14, 2023
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE
- Publication number 20230282608
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
- Publication number 20230187326
- Publication date Jun 15, 2023
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Improved Performance in Operation and Imp...
- Publication number 20220384305
- Publication date Dec 1, 2022
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Connection Lug
- Publication number 20220375830
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Package with Connection Lug
- Publication number 20220375832
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...
- Publication number 20220165687
- Publication date May 26, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...
- Publication number 20220157774
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...
- Publication number 20220102301
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...
- Publication number 20220102311
- Publication date Mar 31, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Signal Distribution Element
- Publication number 20210384111
- Publication date Dec 9, 2021
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...
- Publication number 20210249334
- Publication date Aug 12, 2021
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20210225744
- Publication date Jul 22, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Additive Manufacturing of a Frontside or Backside Interconnect of a...
- Publication number 20210225798
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...
- Publication number 20210225734
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SEPARATE SUBSTRATE SECTIONS
- Publication number 20210111108
- Publication date Apr 15, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...
- Publication number 20210005557
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming a Semiconductor Package
- Publication number 20200365548
- Publication date Nov 19, 2020
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
- Publication number 20200365553
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package, Method of Forming a Chip Package, Semiconductor Devic...
- Publication number 20200328141
- Publication date Oct 15, 2020
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS

Martin Gruber

Person

Patents Grantslast 30 patents

Electronic module comprising a semiconductor package with integrate...

Semiconductor device with improved performance in operation and imp...

Leadframe, encapsulated package with punched lead and sawn side fla...

Semiconductor packages including electrical redistribution layers o...

Method of forming a semiconductor package with connection lug

Semiconductor device module having vertical metallic contacts and a...

Semiconductor device including an embedded semiconductor die

Device for controlling trapped ions and method of manufacturing the...

Semiconductor device package comprising a pin in the form of a dril...

Electronic module including a semiconductor package connected to a...

Semiconductor device having a carrier, semiconductor chip packages...

Package with elevated lead and structure extending vertically from...

Semiconductor package with connection lug

Semiconductor package with signal distribution element

Semiconductor package and method of forming a semiconductor package

Package with separate substrate sections

Additive manufacturing of a frontside or backside interconnect of a...

Plurality of transistor packages with exposed source and drain cont...

Clip frame assembly, semiconductor package having a lead frame and...

Processing of one or more carrier bodies and electronic components...

Silicon carbide device and method for forming a silicon carbide device

Batch manufacture of packages by sheet separated into carriers afte...

Magnetic current sensor

Semiconductor device comprising a composite material clip

Clip frame assembly, semiconductor package having a lead frame and...

Semiconductor package system

Power package having multiple mold compounds

Stacked die semiconductor package with electrical interposer

Electronic module comprising a plurality of encapsulation layers an...

Semiconductor device having die pads with exposed surfaces

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

DEVICE FOR CONTROLLING TRAPPED IONS

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...

SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...

LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

Semiconductor Device with Improved Performance in Operation and Imp...

Semiconductor Package with Connection Lug

Method of Forming a Semiconductor Package with Connection Lug

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...

SEMICONDUCTOR PACKAGES INCLUDING ELECTRICAL REDISTRIBUTION LAYERS O...

DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

Semiconductor Package with Signal Distribution Element

SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

Additive Manufacturing of a Frontside or Backside Interconnect of a...

ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

PACKAGE WITH SEPARATE SUBSTRATE SECTIONS

PROCESSING OF ONE OR MORE CARRIER BODIES AND ELECTRONIC COMPONENTS...

Semiconductor Package and Method of Forming a Semiconductor Package

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

Chip Package, Method of Forming a Chip Package, Semiconductor Devic...