Martin LAPKE

Person

Hamburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma dicing with blade saw patterned underside mask
- Patent number 9,847,258
- Issue date Dec 19, 2017
- NXP B.V.
- Thomas Rohleder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination grinding after laser (GAL) and laser on-off function to...
- Patent number 9,812,361
- Issue date Nov 7, 2017
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching and stealth dicing laser process
- Patent number 9,601,437
- Issue date Mar 21, 2017
- NXP B.V.
- Guido Albermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, device and method for wafer dicing
- Patent number 9,349,645
- Issue date May 24, 2016
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Device and use of the device for measuring the density and/or the e...
- Patent number 9,113,543
- Issue date Aug 18, 2015
- Ruhr-Universität Bochum
- Ralf Peter Brinkmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High die strength semiconductor wafer processing method and system
- Patent number 8,809,166
- Issue date Aug 19, 2014
- NXP B.V.
- Hartmut Buenning
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK
- Publication number 20170092540
- Publication date Mar 30, 2017
- NXP B.V.
- Thomas ROHLEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATERIAL REMOVAL
- Publication number 20160172243
- Publication date Jun 16, 2016
- NXP B.V.
- SASCHA MOELLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING AND STEALTH DICING LASER PROCESS
- Publication number 20160071770
- Publication date Mar 10, 2016
- NXP B.V.
- Guido ALBERMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
- Publication number 20150104931
- Publication date Apr 16, 2015
- NXP B.V.
- Martin Lapke
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...
- Publication number 20150069578
- Publication date Mar 12, 2015
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM
- Publication number 20140179083
- Publication date Jun 26, 2014
- NXP B.V.
- HARTMUT BUENNING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SEPARATION
- Publication number 20140145294
- Publication date May 29, 2014
- NXP B.V.
- Sascha Moeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND USE OF THE DEVICE FOR MEASURING THE DENSITY AND/OR THE E...
- Publication number 20130160523
- Publication date Jun 27, 2013
- RUHR-UNIVERSITÄT BOCHUM
- Ralf Peter Brinkmann
- H01 - BASIC ELECTRIC ELEMENTS

Martin LAPKE

Person

Patents Grantslast 30 patents

Plasma dicing with blade saw patterned underside mask

Combination grinding after laser (GAL) and laser on-off function to...

Plasma etching and stealth dicing laser process

Apparatus, device and method for wafer dicing

Device and use of the device for measuring the density and/or the e...

High die strength semiconductor wafer processing method and system

Patents Applicationslast 30 patents

PLASMA DICING WITH BLADE SAW PATTERNED UNDERSIDE MASK

WAFER MATERIAL REMOVAL

PLASMA ETCHING AND STEALTH DICING LASER PROCESS

APPARATUS, DEVICE AND METHOD FOR WAFER DICING

COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...

HIGH DIE STRENGTH SEMICONDUCTOR WAFER PROCESSING METHOD AND SYSTEM

WAFER SEPARATION

DEVICE AND USE OF THE DEVICE FOR MEASURING THE DENSITY AND/OR THE E...