Martin Richard NIESSNER

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package with elevated lead and structure extending vertically from...
- Patent number 11,862,582
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a non-galvanic connection
- Patent number 11,251,146
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier laminate with high frequency dielectric and thermomech...
- Patent number 10,607,911
- Issue date Mar 31, 2020
- Infineon Technologies AG
- Martin Richard Niessner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF system with an RFIC and antenna system
- Patent number 10,408,919
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Saverio Trotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF system with an RFIC and antenna system
- Patent number 10,317,512
- Issue date Jun 11, 2019
- Infineon Technologies AG
- Saverio Trotta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...
- Publication number 20220165687
- Publication date May 26, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION
- Publication number 20200321295
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...
- Publication number 20190198455
- Publication date Jun 27, 2019
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF System with an RFIC and Antenna System
- Publication number 20190113601
- Publication date Apr 18, 2019
- INFINEON TECHNOLOGIES AG
- Saverio Trotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
- Publication number 20180374769
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier laminate with high frequency dielectric and thermomech...
- Publication number 20160211189
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Martin Richard NIESSNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF System with an RFIC and Antenna System
- Publication number 20160178730
- Publication date Jun 23, 2016
- INFINEON TECHNOLOGIES AG
- Saverio Trotta
- G01 - MEASURING TESTING

Martin Richard NIESSNER

Person

Patents Grantslast 30 patents

Package with elevated lead and structure extending vertically from...

Semiconductor devices having a non-galvanic connection

Electronic device including redistribution layer pad having a void

Chip carrier laminate with high frequency dielectric and thermomech...

RF system with an RFIC and antenna system

RF system with an RFIC and antenna system

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

PACKAGE WITH ELEVATED LEAD AND STRUCTURE EXTENDING VERTICALLY FROM...

SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION

SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...

RF System with an RFIC and Antenna System

ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID

Chip carrier laminate with high frequency dielectric and thermomech...

RF System with an RFIC and Antenna System