Martin Standing

Person

Velden, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component, system and method
- Patent number 10,553,557
- Issue date Feb 4, 2020
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, LED module and method
- Patent number 10,361,178
- Issue date Jul 23, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for electrically coupling a plurality of semiconductor devic...
- Patent number 10,257,937
- Issue date Apr 9, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having a heat-sink thermally coupled to a heat...
- Patent number 10,249,551
- Issue date Apr 2, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having a heat-sink thermally coupled to a heat...
- Patent number 10,217,688
- Issue date Feb 26, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of inserting an electronic component into a slot in a circui...
- Patent number 10,192,846
- Issue date Jan 29, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protection envelope and method
- Patent number 10,074,616
- Issue date Sep 11, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of providing a semiconductor carrier and redistri...
- Patent number 10,064,287
- Issue date Aug 28, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for dissipating heat from a semicon...
- Patent number 10,032,688
- Issue date Jul 24, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, arrangement and method
- Patent number 9,978,719
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power in lead
- Patent number 9,974,187
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of providing a semiconductor carrier and redistri...
- Patent number 9,974,190
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for electrically coupling a semicon...
- Patent number 9,917,024
- Issue date Mar 13, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance vertical interconnection
- Patent number 9,867,277
- Issue date Jan 9, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with internal electrical connections...
- Patent number 9,831,147
- Issue date Nov 28, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 9,824,977
- Issue date Nov 21, 2017
- Infineon Technologies AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency embedding technology
- Patent number 9,769,928
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,741,635
- Issue date Aug 22, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for embedding devices in printed circuit board...
- Patent number 9,653,370
- Issue date May 16, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package
- Patent number 9,653,322
- Issue date May 16, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply and method
- Patent number 9,642,289
- Issue date May 2, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package with conductive clips
- Patent number 9,620,471
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component integrated with semiconductor device in semicondu...
- Patent number 9,595,512
- Issue date Mar 14, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component as thermal capacitance and heat sink
- Patent number 9,559,047
- Issue date Jan 31, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,056
- Issue date Jan 31, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 9,496,205
- Issue date Nov 15, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated semiconductor devices and pas...
- Patent number 9,496,245
- Issue date Nov 15, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing an electronic module
- Patent number 9,472,541
- Issue date Oct 18, 2016
- Infineon Technologies AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Having a Heat-Sink Thermally Coupled to a Heat...
- Publication number 20170317005
- Publication date Nov 2, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Supply And Method
- Publication number 20170196118
- Publication date Jul 6, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip Protection Envelope and Method
- Publication number 20170154856
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component and Method
- Publication number 20170154831
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Supply and Method
- Publication number 20170094842
- Publication date Mar 30, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection Structure, LED Module and Method
- Publication number 20170092631
- Publication date Mar 30, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component and Method for Electrically Coupling a Semicon...
- Publication number 20160322271
- Publication date Nov 3, 2016
- lnfineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clip
- Publication number 20160300811
- Publication date Oct 13, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20160293550
- Publication date Oct 6, 2016
- INFINEON TECHNOLOGIES AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component, System and Method
- Publication number 20160126210
- Publication date May 5, 2016
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method
- Publication number 20160128197
- Publication date May 5, 2016
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component
- Publication number 20160128198
- Publication date May 5, 2016
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086881
- Publication date Mar 24, 2016
- lnfineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT INTEGRATED WITH SEMICONDUCTOR DEVICE IN SEMICONDU...
- Publication number 20160013169
- Publication date Jan 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Semiconductor Devices and Pas...
- Publication number 20160013168
- Publication date Jan 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Electrically Coupling a Plurality of Semicond...
- Publication number 20160007470
- Publication date Jan 7, 2016
- Infineon Technologies Austria AG
- Martin STANDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method for electrically coupling a semicon...
- Publication number 20160005684
- Publication date Jan 7, 2016
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method for dissipating heat from a semicon...
- Publication number 20160005673
- Publication date Jan 7, 2016
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing an Electronic Module
- Publication number 20150371979
- Publication date Dec 24, 2015
- INFINEON TECHNOLOGIES AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGING TECHNOLOGY
- Publication number 20150371935
- Publication date Dec 24, 2015
- Infineon Technologies Austria AG
- Martin STANDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20150340304
- Publication date Nov 26, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Dies
- Publication number 20150332988
- Publication date Nov 19, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY EMBEDDING TECHNOLOGY
- Publication number 20150319864
- Publication date Nov 5, 2015
- Infineon Technologies Austria AG
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Package with Conductive Clips
- Publication number 20150262960
- Publication date Sep 17, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clip
- Publication number 20150255382
- Publication date Sep 10, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20150255376
- Publication date Sep 10, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component, Arrangement and Method
- Publication number 20150216054
- Publication date Jul 30, 2015
- Infineon Technologies Austria AG
- Martin Standing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Martin Standing

Person

Patents Grantslast 30 patents

Electronic component, system and method

Interconnection structure, LED module and method

Device for electrically coupling a plurality of semiconductor devic...

Electronic component having a heat-sink thermally coupled to a heat...

Electronic component having a heat-sink thermally coupled to a heat...

Method of inserting an electronic component into a slot in a circui...

Semiconductor package including a semiconductor die having redistri...

Chip protection envelope and method

System and method of providing a semiconductor carrier and redistri...

Electronic component and method for dissipating heat from a semicon...

Electronic component, arrangement and method

Power in lead

System and method of providing a semiconductor carrier and redistri...

Electronic component and method for electrically coupling a semicon...

High performance vertical interconnection

Packaged semiconductor device with internal electrical connections...

Semiconductor packages and methods of forming the same

Semiconductor package with conductive clip

High efficiency embedding technology

Electronic component

Systems and methods for embedding devices in printed circuit board...

Method for fabricating a semiconductor package

Power supply and method

Power semiconductor package with conductive clips

Passive component integrated with semiconductor device in semicondu...

Passive component as thermal capacitance and heat sink

Electronic component

Power semiconductor package

Semiconductor package with integrated semiconductor devices and pas...

Methods for manufacturing an electronic module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

Electronic Component Having a Heat-Sink Thermally Coupled to a Heat...

Power Supply And Method

Chip Protection Envelope and Method

Electronic Component and Method

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

Power Supply and Method

Interconnection Structure, LED Module and Method

Electronic Component and Method for Electrically Coupling a Semicon...

Semiconductor Package with Conductive Clip

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Electronic Component, System and Method

System and Method

Electronic Component

Electronic Component

PASSIVE COMPONENT INTEGRATED WITH SEMICONDUCTOR DEVICE IN SEMICONDU...

Semiconductor Package with Integrated Semiconductor Devices and Pas...

Method and Device for Electrically Coupling a Plurality of Semicond...

Electronic component and method for electrically coupling a semicon...

Electronic component and method for dissipating heat from a semicon...

Methods for Manufacturing an Electronic Module

EMBEDDED CHIP PACKAGING TECHNOLOGY

Power Semiconductor Package

Semiconductor Package with Multiple Dies

HIGH EFFICIENCY EMBEDDING TECHNOLOGY

Power Semiconductor Package with Conductive Clips

Semiconductor Package with Conductive Clip

Power Semiconductor Package

Electronic Component, Arrangement and Method