Marvin W. Cowens

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-based methodology of widening the pitch of semiconductor chip...
- Patent number 8,674,504
- Issue date Mar 18, 2014
- Texas Systems Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,445,960
- Issue date Nov 4, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,319,275
- Issue date Jan 15, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,276,401
- Issue date Oct 2, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,271,494
- Issue date Sep 18, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 6,869,831
- Issue date Mar 22, 2005
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer marker
- Patent number 6,087,192
- Issue date Jul 11, 2000
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...
- Publication number 20090039524
- Publication date Feb 12, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DISPENSE AT SUBSTRATE APERTURE
- Publication number 20080085573
- Publication date Apr 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20080050860
- Publication date Feb 28, 2008
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20070128881
- Publication date Jun 7, 2007
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching solder balls to substrate
- Publication number 20070111500
- Publication date May 17, 2007
- Marvin W. Cowens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill dispense at substrate aperture
- Publication number 20060234427
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20050212149
- Publication date Sep 29, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip
- Publication number 20050161834
- Publication date Jul 28, 2005
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package
- Publication number 20050151273
- Publication date Jul 14, 2005
- Richard Willson Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion by plasma conditioning of semiconductor chip surfaces
- Publication number 20030052414
- Publication date Mar 20, 2003
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Marvin W. Cowens

Person

Patents Grantslast 30 patents

Wire-based methodology of widening the pitch of semiconductor chip...

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip surfaces

Polymer marker

Patents Applicationslast 30 patents

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED...

UNDERFILL DISPENSE AT SUBSTRATE APERTURE

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and apparatus for attaching solder balls to substrate

Underfill dispense at substrate aperture

Adhesion by plasma conditioning of semiconductor chip surfaces

Adhesion by plasma conditioning of semiconductor chip

Semiconductor chip package

Adhesion by plasma conditioning of semiconductor chip surfaces