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Masaaki Hoshiyama
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Niigata-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Syringe filled with resin composition and storage method therefor
Patent number
11,850,625
Issue date
Dec 26, 2023
Namics Corporation
Hiroki Myodo
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Resin composition-filled syringe, and production method and preserv...
Patent number
11,623,813
Issue date
Apr 11, 2023
Namics Corporation
Hiroki Myodo
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
NCF for pressure mounting, cured product thereof, and semiconductor...
Patent number
11,485,848
Issue date
Nov 1, 2022
Namics Corporation
Kenichi Tosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,315,846
Issue date
Apr 26, 2022
Namics Corporation
Hiroki Myodo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition and method of producing same
Patent number
10,388,583
Issue date
Aug 20, 2019
Namics Corporation
Masaaki Hoshiyama
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method of predicting viscosity behavior of thermosetting resin, sim...
Patent number
9,417,228
Issue date
Aug 16, 2016
Namics Corporation
Toshiaki Enomoto
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
RESIN COMPOSITION-FILLED SYRINGE, AND PRODUCTION METHOD AND PRESERV...
Publication number
20220144531
Publication date
May 12, 2022
Namics Corporation
Hiroki MYODO
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
SYRINGE FILLED WITH RESIN COMPOSITION AND STORAGE METHOD THEREFOR
Publication number
20220072582
Publication date
Mar 10, 2022
Namics Corporation
Hiroki MYODO
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20200227329
Publication date
Jul 16, 2020
Namics Corporation
Hiroki MYODO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR...
Publication number
20200207977
Publication date
Jul 2, 2020
NAMICS CORPORATION
Kenichi Tosaka
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
PREFILLED SYRINGE AND PRESERVATION METHOD FOR RESIN COMPOSITE
Publication number
20200001011
Publication date
Jan 2, 2020
Namics Corporation
Hiroki MYODO
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
THERMOSETTING RESIN COMPOSITION AND METHOD OF PRODUCING SAME
Publication number
20170301597
Publication date
Oct 19, 2017
Namics Corporation
Masaaki Hoshiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIM...
Publication number
20140316102
Publication date
Oct 23, 2014
Toshiaki Enomoto
G01 - MEASURING TESTING
Information
Patent Application
Liquid resin composition for underfill, flip-chip mounted body and...
Publication number
20100244279
Publication date
Sep 30, 2010
NAMICS CORPORATION
Masaaki Hoshiyama
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...