Masaharu Kobayashi

Person

Shizuoka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting low-dielectric resin composition and use thereof
- Patent number 6,713,143
- Issue date Mar 30, 2004
- Tomegawa Paper Co., Ltd.
- Takeshi Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and adhesive sheet for semiconductor devices
- Patent number 6,617,021
- Issue date Sep 9, 2003
- Tomoegawa Paper Co., Inc.
- Masaharu Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermoplastic resin composition having low permittivity, prepreg, l...
- Patent number 6,492,030
- Issue date Dec 10, 2002
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting low-dielectric resin composition and use thereof
- Patent number 6,346,598
- Issue date Feb 12, 2002
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrostatic chuck device
- Patent number 6,256,187
- Issue date Jul 3, 2001
- Tomoegawa Paper Co., Ltd.
- Tadao Matsunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,512,628
- Issue date Apr 30, 1996
- Tomoegawa Paper Co., Ltd.
- Yukinori Sakumoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,510,189
- Issue date Apr 23, 1996
- Tomoegawa Paper Co., Ltd.
- Yukinori Sakumoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,500,294
- Issue date Mar 19, 1996
- Tomoegawa Paper Co., Ltd.
- Yukinori Sakumoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,494,757
- Issue date Feb 27, 1996
- Tomoegawa Paper Co., Ltd.
- Yukinori Sakumoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid adhesive for electronic parts and process for forming insula...
- Patent number 5,446,080
- Issue date Aug 29, 1995
- Tomoegawa Paper Co., Ltd.
- Takeshi Shima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile co...
- Patent number 5,428,113
- Issue date Jun 27, 1995
- Tomoegawa Paper Co., Ltd.
- Yukinori Sakumoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Adhesive composition and adhesive sheet for semiconductor devices
- Publication number 20020155286
- Publication date Oct 24, 2002
- Masaharu Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermosetting low-dielectric resin composition and use thereof
- Publication number 20020106521
- Publication date Aug 8, 2002
- Takeshi Hashimoto
- B32 - LAYERED PRODUCTS

Masaharu Kobayashi

Person

Patents Grantslast 30 patents

Thermosetting low-dielectric resin composition and use thereof

Adhesive composition and adhesive sheet for semiconductor devices

Thermoplastic resin composition having low permittivity, prepreg, l...

Thermosetting low-dielectric resin composition and use thereof

Electrostatic chuck device

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts and liquid adhesive

Liquid adhesive for electronic parts and process for forming insula...

Piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile co...

Patents Applicationslast 30 patents

Adhesive composition and adhesive sheet for semiconductor devices

Thermosetting low-dielectric resin composition and use thereof