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Masahiro Kodama
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Nagano, JP
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last 30 patents
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Patent Grant
Apparatus for sealing a semiconductor device utilizing a release film
Patent number
6,459,159
Issue date
Oct 1, 2002
Apic Yamada Corporation
Tsutomu Miyagawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Patent Grant
Resin sealing method for a semiconductor device
Patent number
6,261,501
Issue date
Jul 17, 2001
Apic Yamada Corporation
Tsutomu Miyagawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL