Masakazu Ishino

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,937,390
- Issue date Jan 20, 2015
- PS4 Luxco S.A.R.L.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,704,352
- Issue date Apr 22, 2014
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 8,513,121
- Issue date Aug 20, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 8,298,940
- Issue date Oct 30, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 7,893,540
- Issue date Feb 22, 2011
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having a smaller electrostatic capacitance ele...
- Patent number 7,791,196
- Issue date Sep 7, 2010
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a three-dimensional semiconductor device a...
- Patent number 7,754,581
- Issue date Jul 13, 2010
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module with improved mechanical strength of chips
- Patent number 7,638,362
- Issue date Dec 29, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor and laminated structure fabricated...
- Patent number 7,618,847
- Issue date Nov 17, 2009
- Elpida Memory, Inc.
- Hiroyuki Tenmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 7,576,433
- Issue date Aug 18, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory module that is capable of controlling input/output in accord...
- Patent number 7,564,127
- Issue date Jul 21, 2009
- Elpida Memory, Inc.
- Hiroaki Ikeda
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrode structure of a wiring substrate of semiconductor device h...
- Patent number 6,137,185
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrates methods for manufacturing multilayer substrat...
- Patent number 5,939,789
- Issue date Aug 17, 1999
- Hitachi, Ltd.
- Michifumi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of wiring substrate of semiconductor device hav...
- Patent number 5,886,409
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming multilayer wiring
- Patent number 5,670,421
- Issue date Sep 23, 1997
- Hitachi, Ltd.
- Eisuke Nishitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming multilayer wiring
- Patent number 5,498,768
- Issue date Mar 12, 1996
- Hitachi, Ltd.
- Eisuke Nishitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target
- Patent number 5,320,729
- Issue date Jun 14, 1994
- Hitachi, Ltd.
- Yasunori Narizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board provided with a heat bypass layer
- Patent number 5,285,016
- Issue date Feb 8, 1994
- Hitachi, Ltd.
- Yasunori Narizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor and wiring board using the same
- Patent number 5,235,313
- Issue date Aug 10, 1993
- Hitachi, Ltd.
- Yasunori Narizuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20140183730
- Publication date Jul 3, 2014
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130011967
- Publication date Jan 10, 2013
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110104852
- Publication date May 5, 2011
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20100171213
- Publication date Jul 8, 2010
- Elpida Memory, Inc.
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090294990
- Publication date Dec 3, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090134498
- Publication date May 28, 2009
- Elpida Memory, Inc.
- Hiroaki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
- Publication number 20090109641
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...
- Publication number 20090072414
- Publication date Mar 19, 2009
- Hiroyuki TENMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...
- Publication number 20080164575
- Publication date Jul 10, 2008
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080136024
- Publication date Jun 12, 2008
- Elpida Memory, Inc.
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a semiconductor device
- Publication number 20080009124
- Publication date Jan 10, 2008
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SMALLER ELECTROSTATIC CAPACITANCE ELE...
- Publication number 20070252273
- Publication date Nov 1, 2007
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device
- Publication number 20070181991
- Publication date Aug 9, 2007
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory device and manufacturing method thereof
- Publication number 20070001281
- Publication date Jan 4, 2007
- ELPIDA MEMORY, INC.
- Masakazu Ishino
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY MODULE WITH IMPROVED MECHANICAL STRENGTH OF CHIPS
- Publication number 20060267188
- Publication date Nov 30, 2006
- ELPIDA MEMORY, INC.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module that is capable of controlling input/output in accord...
- Publication number 20060235577
- Publication date Oct 19, 2006
- Elpida Memory, Inc.
- Hiroaki Ikeda
- G11 - INFORMATION STORAGE

Masakazu Ishino

Person

Patents Grantslast 30 patents

Semiconductor device having a liquid cooling module

Semiconductor device having a liquid cooling module

Semiconductor memory device and manufacturing method thereof

Wafer of circuit board and joining structure of wafer or circuit board

Semiconductor memory device and manufacturing method thereof

Semiconductor memory device and manufacturing method thereof

Semiconductor device having a smaller electrostatic capacitance ele...

Method for manufacturing a three-dimensional semiconductor device a...

Memory module with improved mechanical strength of chips

Bonding method of semiconductor and laminated structure fabricated...

Semiconductor memory device and manufacturing method thereof

Memory module that is capable of controlling input/output in accord...

Electrode structure of a wiring substrate of semiconductor device h...

Multilayer substrates methods for manufacturing multilayer substrat...

Electrode structure of wiring substrate of semiconductor device hav...

Process for forming multilayer wiring

Process for forming multilayer wiring

Sputtering target

Wiring board provided with a heat bypass layer

Thin film resistor and wiring board using the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS

Wafer of circuit board and joining structure of wafer or circuit board

BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...

METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...

SEMICONDUCTOR DEVICE

Method of forming a semiconductor device

SEMICONDUCTOR DEVICE HAVING A SMALLER ELECTROSTATIC CAPACITANCE ELE...

Stacked semiconductor device

Semiconductor memory device and manufacturing method thereof

MEMORY MODULE WITH IMPROVED MECHANICAL STRENGTH OF CHIPS

Memory module that is capable of controlling input/output in accord...