Masako Kodera

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,799,917
- Issue date Oct 13, 2020
- Ebara Corporation
- Yu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal analysis apparatus and crystal analysis method
- Patent number 10,692,206
- Issue date Jun 23, 2020
- Kabushiki Kaisha Toshiba
- Masako Kodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 10,586,694
- Issue date Mar 10, 2020
- TOSHIBA MEMORY CORPORATION
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,328,465
- Issue date Jun 25, 2019
- Ebara Corporation
- Yu Ishii
- B08 - CLEANING
Information Patent Grant
Semiconductor device
- Patent number 10,256,314
- Issue date Apr 9, 2019
- Kabushiki Kaisha Toshiba
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 9,937,602
- Issue date Apr 10, 2018
- TOSHIBA MEMORY CORPORATION
- Yosuke Otsuka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical planarization and chemical planarization apparatus
- Patent number 9,196,501
- Issue date Nov 24, 2015
- Kabushiki Kaisha Toshiba
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,754,433
- Issue date Jun 17, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 8,740,667
- Issue date Jun 3, 2014
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical planarization and chemical planarization apparatus
- Patent number 8,703,004
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device including a metal wiring with a metal cap
- Patent number 8,614,510
- Issue date Dec 24, 2013
- Kabushiki Kaisha Toshiba
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a wet process
- Patent number 7,727,891
- Issue date Jun 1, 2010
- Kabushiki Kaisha Toshiba
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and apparatus
- Patent number 7,101,259
- Issue date Sep 5, 2006
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,992,009
- Issue date Jan 31, 2006
- Kabushiki Kaisha Toshiba
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a wet process
- Patent number 6,903,015
- Issue date Jun 7, 2005
- Kabushiki Kaisha Toshiba
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electropolishing method
- Patent number 6,783,658
- Issue date Aug 31, 2004
- Kabushiki Kaisha Toshiba
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and apparatus
- Patent number 6,667,238
- Issue date Dec 23, 2003
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polisher used in the method
- Patent number 6,419,557
- Issue date Jul 16, 2002
- Kabushiki Kaisha Toshiba
- Haruki Nojo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor polishing apparatus and method for chemical/mechanica...
- Patent number 6,410,439
- Issue date Jun 25, 2002
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polisher used in the method
- Patent number 6,224,464
- Issue date May 1, 2001
- Kabushiki Kaisha Toshiba
- Haruki Nojo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing apparatus and method for planarizing layer on a semicondu...
- Patent number 5,948,205
- Issue date Sep 7, 1999
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method for planarizing layer on a semicondu...
- Patent number 5,914,275
- Issue date Jun 22, 1999
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for cleaning workpiece
- Patent number 5,860,181
- Issue date Jan 19, 1999
- Ebara Corporation
- Toshiro Maekawa
- B08 - CLEANING
Information Patent Grant
Polishing apparatus
- Patent number 5,860,847
- Issue date Jan 19, 1999
- Ebara Corporation
- Kunihiko Sakurai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for cleaning workpiece
- Patent number 5,846,335
- Issue date Dec 8, 1998
- Ebara Corporation
- Toshiro Maekawa
- B08 - CLEANING
Information Patent Grant
Method and apparatus for determining endpoint during a polishing pr...
- Patent number 5,830,041
- Issue date Nov 3, 1998
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for planarizing a semiconductor body by CMP method and an ap...
- Patent number 5,695,601
- Issue date Dec 9, 1997
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus with improved exhaust
- Patent number 5,653,623
- Issue date Aug 5, 1997
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 5,616,063
- Issue date Apr 1, 1997
- Kabushiki Kaisya Toshiba
- Katsuya Okumura
- B08 - CLEANING
Information Patent Grant
Semiconductor planarizing apparatus
- Patent number 5,597,341
- Issue date Jan 28, 1997
- Kabushiki Kaisha Toshiba
- Masako Kodera
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20190262870
- Publication date Aug 29, 2019
- EBARA CORPORATION
- Yu Ishii
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20190262869
- Publication date Aug 29, 2019
- EBARA CORPORATION
- Yu Ishii
- B08 - CLEANING
Information Patent Application
CRYSTAL ANALYSIS APPARATUS AND CRYSTAL ANALYSIS METHOD
- Publication number 20190005635
- Publication date Jan 3, 2019
- Kabushiki Kaisha Toshiba
- Masako KODERA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180097096
- Publication date Apr 5, 2018
- Kabushiki Kaisha Toshiba
- Toru SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170263724
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Masako KODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20160375547
- Publication date Dec 29, 2016
- Kabushiki Kaisha Toshiba
- Yosuke OTSUKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20160358768
- Publication date Dec 8, 2016
- Kabushiki Kaisha Toshiba
- Masako KODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20160035598
- Publication date Feb 4, 2016
- Kabushiki Kaisha Toshiba
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20150290765
- Publication date Oct 15, 2015
- Kabushiki Kaisha Toshiba
- Yosuke OTSUKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20140187042
- Publication date Jul 3, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20130217228
- Publication date Aug 22, 2013
- Masako KODERA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20130213437
- Publication date Aug 22, 2013
- Kabushiki Kaisha Toshiba
- Yu Ishii
- B08 - CLEANING
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20130119013
- Publication date May 16, 2013
- Yukiteru MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20130115774
- Publication date May 9, 2013
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20130115855
- Publication date May 9, 2013
- Masako KODERA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130095656
- Publication date Apr 18, 2013
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20130084400
- Publication date Apr 4, 2013
- Masako KODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING METHOD AND CLEANING APPARATUS
- Publication number 20120160267
- Publication date Jun 28, 2012
- Masako KODERA
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110294291
- Publication date Dec 1, 2011
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100237501
- Publication date Sep 23, 2010
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for cleaning a substrate having metal interconnects
- Publication number 20080017220
- Publication date Jan 24, 2008
- Masako Kodera
- B08 - CLEANING
Information Patent Application
Polishing Apparatus and Polishing Method
- Publication number 20070254558
- Publication date Nov 1, 2007
- Masako Kodera
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20070205112
- Publication date Sep 6, 2007
- Masako Kodera
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device fabrication method and polishing apparatus
- Publication number 20070173056
- Publication date Jul 26, 2007
- Kabushiki Kaisha Toshiba
- Masako Kodera
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20050148176
- Publication date Jul 7, 2005
- Kabushiki Kaisha Toshiba
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for cleaning a substrate having metal interconnects
- Publication number 20040177655
- Publication date Sep 16, 2004
- Masako Kodera
- B08 - CLEANING
Information Patent Application
Polishing method and apparatus
- Publication number 20040087258
- Publication date May 6, 2004
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20030186544
- Publication date Oct 2, 2003
- Yoshitaka Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electropolishing method
- Publication number 20030066760
- Publication date Apr 10, 2003
- Yoshitaka Matsui
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20030068888
- Publication date Apr 10, 2003
- Masako Kodera
- H01 - BASIC ELECTRIC ELEMENTS

Masako Kodera

Person

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Crystal analysis apparatus and crystal analysis method

Method for fabricating semiconductor device

Substrate processing apparatus and substrate processing method

Semiconductor device

Substrate processing method

Method for chemical planarization and chemical planarization apparatus

Semiconductor device and method of manufacturing the same

Polishing method and polishing apparatus

Method for chemical planarization and chemical planarization apparatus

Semiconductor device including a metal wiring with a metal cap

Method of manufacturing a semiconductor device using a wet process

Polishing method and apparatus

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device using a wet process

Electropolishing method

Polishing method and apparatus

Polishing method and polisher used in the method

Semiconductor polishing apparatus and method for chemical/mechanica...

Polishing method and polisher used in the method

Polishing apparatus and method for planarizing layer on a semicondu...

Polishing apparatus and method for planarizing layer on a semicondu...

Method of and apparatus for cleaning workpiece

Polishing apparatus

Method for cleaning workpiece

Method and apparatus for determining endpoint during a polishing pr...

Method for planarizing a semiconductor body by CMP method and an ap...

Polishing apparatus with improved exhaust

Polishing apparatus

Semiconductor planarizing apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CRYSTAL ANALYSIS APPARATUS AND CRYSTAL ANALYSIS METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING METHOD

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

SUBSTRATE PROCESSING METHOD

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD

CLEANING METHOD AND CLEANING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Apparatus for cleaning a substrate having metal interconnects

Polishing Apparatus and Polishing Method

Polishing apparatus and polishing method

Semiconductor device fabrication method and polishing apparatus

Method of manufacturing a semiconductor device

Apparatus for cleaning a substrate having metal interconnects

Polishing method and apparatus

Method of manufacturing a semiconductor device

Electropolishing method

Method of manufacturing a semiconductor device