Masami Yusa

Person

Shimodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, circuit connecting material, connection struc...
- Patent number 8,696,942
- Issue date Apr 15, 2014
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, circuit connecting material, connection struc...
- Patent number 8,518,303
- Issue date Aug 27, 2013
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, circuit connecting material, connecting struc...
- Patent number 8,309,658
- Issue date Nov 13, 2012
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film-like adhesive, adhesive sheet, and semiconductor device using...
- Patent number 8,293,847
- Issue date Oct 23, 2012
- Hitachi Chemical Co., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, circuit connecting material, connecting struc...
- Patent number 8,138,268
- Issue date Mar 20, 2012
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 8,029,911
- Issue date Oct 4, 2011
- Hitachi Chemical Company, Ltd.
- Satoyuki Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, adhesive composition for circuit connection,...
- Patent number 7,795,325
- Issue date Sep 14, 2010
- Hitachi Chemical Co., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,781,896
- Issue date Aug 24, 2010
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,771,559
- Issue date Aug 10, 2010
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, adhesive composition for circuit connection,...
- Patent number 7,576,141
- Issue date Aug 18, 2009
- Hitachi Chemical Co., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,528,488
- Issue date May 5, 2009
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,387,914
- Issue date Jun 17, 2008
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,258,918
- Issue date Aug 21, 2007
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 7,208,105
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and wiring-connected board production pr...
- Patent number 7,141,645
- Issue date Nov 28, 2006
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,078,094
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,057,265
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,012,320
- Issue date Mar 14, 2006
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,855,579
- Issue date Feb 15, 2005
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, adhesives prepared therewith for bonding circuit...
- Patent number 6,841,628
- Issue date Jan 11, 2005
- Hitachi Chemical Co., Ltd.
- Satoru Oota
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,825,249
- Issue date Nov 30, 2004
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring-connecting material and process for producing circuit board...
- Patent number 6,762,249
- Issue date Jul 13, 2004
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,717,242
- Issue date Apr 6, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip supporting substrate for semiconductor package, semiconductor...
- Patent number 6,331,729
- Issue date Dec 18, 2001
- Hitachi Chemical Company, Ltd.
- Masami Yusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,236,108
- Issue date May 22, 2001
- Hitachi Chemical Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,099,678
- Issue date Aug 8, 2000
- Hitachi Chemical Company Ltd.
- Akio Kotato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for holding a chip of semi-conductor package, semi-conduc...
- Patent number 6,064,111
- Issue date May 16, 2000
- Hitachi Company, Ltd.
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,667,899
- Issue date Sep 16, 1997
- Hitachi Chemical Co. Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,605,763
- Issue date Feb 25, 1997
- Hitachi Chemical Company Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alignment film for liquid crystal, liquid crystal-sandwiched panel,...
- Patent number 5,571,579
- Issue date Nov 5, 1996
- Hitachi Chemical Company, Ltd.
- Toshihiko Kato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20120273974
- Publication date Nov 1, 2012
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUC...
- Publication number 20120063109
- Publication date Mar 15, 2012
- Shigeki KATOGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...
- Publication number 20110193244
- Publication date Aug 11, 2011
- Takashi MASUKO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUC...
- Publication number 20110176288
- Publication date Jul 21, 2011
- Hitachi Chemical Company Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...
- Publication number 20100294551
- Publication date Nov 25, 2010
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...
- Publication number 20100265685
- Publication date Oct 21, 2010
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING...
- Publication number 20100239858
- Publication date Sep 23, 2010
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20090309220
- Publication date Dec 17, 2009
- Hitachi Chemical Co., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION,...
- Publication number 20090261483
- Publication date Oct 22, 2009
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20080290529
- Publication date Nov 27, 2008
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive for circuit connection, circuit connection method using th...
- Publication number 20070166549
- Publication date Jul 19, 2007
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film and process for preparing the same as well as adhesiv...
- Publication number 20070098995
- Publication date May 3, 2007
- HITACHI CHEMICAL CO., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20060260744
- Publication date Nov 23, 2006
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20060263599
- Publication date Nov 23, 2006
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20060252843
- Publication date Nov 9, 2006
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20060180903
- Publication date Aug 17, 2006
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition, adhesive composition for circuit connection,...
- Publication number 20050282924
- Publication date Dec 22, 2005
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20040253770
- Publication date Dec 16, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20040214979
- Publication date Oct 28, 2004
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20030178138
- Publication date Sep 25, 2003
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20030160337
- Publication date Aug 28, 2003
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive for circuit connection , circuit connection method using t...
- Publication number 20030141014
- Publication date Jul 31, 2003
- Nomura Satoyuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition , adhesive prepared therewith for bonding circuit...
- Publication number 20030027942
- Publication date Feb 6, 2003
- Satoru Oota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010035533
- Publication date Nov 1, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010016384
- Publication date Aug 23, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010009780
- Publication date Jul 26, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Masami Yusa

Person

Patents Grantslast 30 patents

Adhesive composition, circuit connecting material, connection struc...

Adhesive composition, circuit connecting material, connection struc...

Adhesive composition, circuit connecting material, connecting struc...

Film-like adhesive, adhesive sheet, and semiconductor device using...

Adhesive composition, circuit connecting material, connecting struc...

Adhesive for circuit connection, circuit connection method using th...

Adhesive composition, adhesive composition for circuit connection,...

Semiconductor device and process for fabrication thereof

Method for connecting electrodes, surface-treated wiring board and...

Adhesive composition, adhesive composition for circuit connection,...

Method for connecting electrodes, surface-treated wiring board and...

Semiconductor device and process for fabrication thereof

Method for connecting electrodes, surface-treated wiring board and...

Adhesive for circuit connection, circuit connection method using th...

Wiring-connecting material and wiring-connected board production pr...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Resin composition, adhesives prepared therewith for bonding circuit...

Laminating method of film-shaped organic die-bonding material, die-...

Wiring-connecting material and process for producing circuit board...

Semiconductor device and process for fabrication thereof

Chip supporting substrate for semiconductor package, semiconductor...

Substrate for holding a chip of semi-conductor package, semi-conduc...

Laminating method of film-shaped organic die-bonding material, die-...

Substrate for holding a chip of semi-conductor package, semi-conduc...

Electrically conductive bonding films

Electrically conductive bonding films

Alignment film for liquid crystal, liquid crystal-sandwiched panel,...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUC...

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUC...

ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...

FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING...

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION,...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Adhesive for circuit connection, circuit connection method using th...

Adhesive film and process for preparing the same as well as adhesiv...

Method for connecting electrodes, surface-treated wiring board and...

Method for connecting electrodes, surface-treated wiring board and...

Wiring-connecting material and wiring-connected board production pr...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Adhesive composition, adhesive composition for circuit connection,...

Semiconductor device and process for fabrication thereof

Wiring-connecting material and wiring-connected board production pr...

Method for connecting electrodes, surface-treated wiring board and...

Semiconductor device and process for fabrication thereof

Adhesive for circuit connection , circuit connection method using t...

Resin composition , adhesive prepared therewith for bonding circuit...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof