Masamitsu Matsuura

Person

Beppu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal ribs in electromechanical devices
- Patent number 12,160,219
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tapered metal coated sidewalls
- Patent number 11,923,320
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Tomoko Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded wafer chip scale packages
- Patent number 11,848,244
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ribs in electromechanical devices
- Patent number 11,736,085
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Anindya Poddar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 11,183,441
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die package multichip module
- Patent number 11,158,595
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multilayer mold
- Patent number 10,879,144
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 10,580,715
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Converter Package with Integrated Inductor
- Publication number 20250046684
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20250038009
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20240379597
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE C...
- Publication number 20240222212
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hall Sensor Using Face Down Structure with Through Substrate Vias
- Publication number 20240210497
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20240213178
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS
- Publication number 20240178329
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
- Publication number 20240178164
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME BASED POWER MODULE
- Publication number 20240178104
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- MAKOTO SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
- Publication number 20230396230
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20230275007
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
- Publication number 20230137762
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED WAFER CHIP SCALE PACKAGES
- Publication number 20230095630
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230068748
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20230005881
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20220208689
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
- Publication number 20220069795
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METAL-COVERED CHIP SCALE PACKAGES
- Publication number 20210125959
- Publication date Apr 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20210111136
- Publication date Apr 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20200203249
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD
- Publication number 20200058570
- Publication date Feb 20, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20190385924
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGE MULTICHIP MODULE
- Publication number 20190013288
- Publication date Jan 10, 2019
- WOOCHAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20160240392
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20150147845
- Publication date May 28, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Masamitsu Matsuura

Person

Patents Grantslast 30 patents

Metal ribs in electromechanical devices

Package for stress sensitive component and semiconductor device

Wafer chip scale package

Semiconductor package having an interdigitated mold arrangement

Semiconductor device having tapered metal coated sidewalls

Leaded wafer chip scale packages

Metal ribs in electromechanical devices

Fan-out electronic device

Stress buffer layer in embedded package

Embedded die package multichip module

Semiconductor package with multilayer mold

Stress buffer layer in embedded package

Patents Applicationslast 30 patents

Converter Package with Integrated Inductor

STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH A REINFORCING LAYER

WAFER CHIP SCALE PACKAGE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE C...

Hall Sensor Using Face Down Structure with Through Substrate Vias

SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS

SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS

SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

LEADFRAME BASED POWER MODULE

METAL RIBS IN ELECTROMECHANICAL DEVICES

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT

LEADED WAFER CHIP SCALE PACKAGES

LEADED SEMICONDUCTOR DEVICE PACKAGE

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS

METAL RIBS IN ELECTROMECHANICAL DEVICES

METAL-COVERED CHIP SCALE PACKAGES

WAFER CHIP SCALE PACKAGE

FAN-OUT ELECTRONIC DEVICE

Stress Buffer Layer in Embedded Package

SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD

Stress Buffer Layer in Embedded Package

EMBEDDED DIE PACKAGE MULTICHIP MODULE

DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND

DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND