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Patents Grants
last 30 patents
Information
Patent Grant
Hollow sealing structure
Patent number
9,125,311
Issue date
Sep 1, 2015
NEC Corporation
Takashi Ueda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
8,916,976
Issue date
Dec 23, 2014
Renesas Electronics Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, mounted substrate to be used in semiconductor...
Patent number
8,791,544
Issue date
Jul 29, 2014
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor inspection apparatus, semiconductor wafer positioning...
Patent number
8,570,056
Issue date
Oct 29, 2013
NEC Corporation
Yoshio Kameda
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor inspecting device and semiconductor inspecting method
Patent number
8,536,890
Issue date
Sep 17, 2013
NEC Corporation
Yoshio Kameda
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device and method of manufacturing same
Patent number
8,513,810
Issue date
Aug 20, 2013
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method and apparatus for the same
Patent number
7,793,818
Issue date
Sep 14, 2010
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor element and a producing method for the same, and a se...
Patent number
7,749,888
Issue date
Jul 6, 2010
NEC Corporation
Tomohiro Nishiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device, wiring substrate, and method for manufacturin...
Patent number
7,728,439
Issue date
Jun 1, 2010
NEC Corporation
Tomohiro Nishiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and wiring board
Patent number
7,692,287
Issue date
Apr 6, 2010
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method and apparatus for the same
Patent number
7,611,041
Issue date
Nov 3, 2009
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device, wiring board, and manufacturing method thereof
Patent number
7,525,189
Issue date
Apr 28, 2009
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element and a producing method for the same, and a se...
Patent number
7,449,406
Issue date
Nov 11, 2008
NEC Corporation
Tomohiro Nishiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System semiconductor device and method of manufacturing the same
Patent number
7,297,575
Issue date
Nov 20, 2007
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method and apparatus for the same
Patent number
7,282,432
Issue date
Oct 16, 2007
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor element including a wet prevention film
Patent number
7,268,438
Issue date
Sep 11, 2007
NEC Corporation
Tomohiro Nishiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compact semiconductor device capable of mounting a plurality of sem...
Patent number
7,218,005
Issue date
May 15, 2007
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element with conductive columnar projection and a sem...
Patent number
7,135,770
Issue date
Nov 14, 2006
NEC Corporation
Tomohiro Nishiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System semiconductor device and method of manufacturing the same
Patent number
7,098,538
Issue date
Aug 29, 2006
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method and apparatus for the same
Patent number
6,969,915
Issue date
Nov 29, 2005
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic apparatus
Patent number
6,882,542
Issue date
Apr 19, 2005
NEC Corporation
Naoya Tamaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compact semiconductor device capable of mounting a plurality of sem...
Patent number
6,844,619
Issue date
Jan 18, 2005
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for laminating and mounting semiconductor chip
Patent number
6,803,253
Issue date
Oct 12, 2004
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating same
Patent number
6,653,731
Issue date
Nov 25, 2003
NEC Corporation
Yoshimasa Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a binary alloy bonding layer
Patent number
6,583,514
Issue date
Jun 24, 2003
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip size package semiconductor device and method of forming the same
Patent number
6,555,416
Issue date
Apr 29, 2003
NEC Corporation
Hirofumi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip size package semiconductor device and method of forming the same
Patent number
6,344,696
Issue date
Feb 5, 2002
NEC Corporation
Hirofumi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for forming bump structure used for flip-chip...
Patent number
5,633,204
Issue date
May 27, 1997
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for forming a double-bump structure used for flip-chip mo...
Patent number
5,508,561
Issue date
Apr 16, 1996
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HOLLOW SEALING STRUCTURE
Publication number
20140166352
Publication date
Jun 19, 2014
NEC Corporation
Takashi Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MOUNTED SUBSTRATE TO BE USED IN SEMICONDUCTOR...
Publication number
20120098089
Publication date
Apr 26, 2012
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20120018726
Publication date
Jan 26, 2012
NEC CORPORATION AND RENESAS ELECTRONICS CORPORATION
Yoshihiro Nakagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
Publication number
20110115092
Publication date
May 19, 2011
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INSPECTING DEVICE AND SEMICONDUCTOR INSPECTING METHOD
Publication number
20100321054
Publication date
Dec 23, 2010
Yoshio Kameda
G01 - MEASURING TESTING
Information
Patent Application
APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR AND SEMICONDUCTOR DE...
Publication number
20100194423
Publication date
Aug 5, 2010
Masamoto Tago
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD AND APPARATUS FOR THE SAME
Publication number
20100015796
Publication date
Jan 21, 2010
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR ELEMENT AND A PRODUCING METHOD FOR THE SAME, AND A SE...
Publication number
20090035893
Publication date
Feb 5, 2009
NEC Corporation
Tomohiro Nishiyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20080237883
Publication date
Oct 2, 2008
NEC Corporation
Masamoto TAGO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Wiring Board
Publication number
20080237890
Publication date
Oct 2, 2008
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked-Chip Semiconductor Device
Publication number
20080217767
Publication date
Sep 11, 2008
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device, Wiring Board, And Manufacturing Method Thereof
Publication number
20080001309
Publication date
Jan 3, 2008
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD AND APPARATUS FOR THE SAME
Publication number
20070295786
Publication date
Dec 27, 2007
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor element and a producing method for the same, and a se...
Publication number
20070020912
Publication date
Jan 25, 2007
NEC Corporation
Tomohiro Nishiyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor device, wiring substrate, and method for manufacturin...
Publication number
20060151870
Publication date
Jul 13, 2006
NEC Corporation
Tomohiro Nishiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor element and a producing method for the same, and a se...
Publication number
20060065978
Publication date
Mar 30, 2006
NEC Corporation
Tomohiro Nishiyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor device, manufacturing method and apparatus for the same
Publication number
20050279812
Publication date
Dec 22, 2005
NEC Corporation
Masamoto Tago
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
System semiconductor device and method of manufacturing the same
Publication number
20050179057
Publication date
Aug 18, 2005
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Compact semiconductor device capable of mounting a plurality of sem...
Publication number
20050082657
Publication date
Apr 21, 2005
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic apparatus
Publication number
20040057220
Publication date
Mar 25, 2004
NEC Corporation
Naoya Tamaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor element and a producing method for the same, and a se...
Publication number
20030151140
Publication date
Aug 14, 2003
NEC Corporation
Tomohiro Nishiyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method for laminating and mounting semiconductor chip
Publication number
20020106831
Publication date
Aug 8, 2002
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device, manufacturing method and apparatus for the same
Publication number
20020093096
Publication date
Jul 18, 2002
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20020090756
Publication date
Jul 11, 2002
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Compact semiconductor device capable of mounting a plurality of sem...
Publication number
20020070458
Publication date
Jun 13, 2002
NEC Corporation
Masamoto Tago
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip size package semiconductor device and method of forming the same
Publication number
20020068383
Publication date
Jun 6, 2002
NEC Corporation
Hirofumi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SIZE PACKAGE SEMICONDUCTOR DEVICE WITHOUT AN INTERPOSER AND ME...
Publication number
20010035586
Publication date
Nov 1, 2001
HIROFUMI NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method for fabricating same
Publication number
20010018229
Publication date
Aug 30, 2001
NBC Corporation
Yoshimasa Kato
H01 - BASIC ELECTRIC ELEMENTS