Number | Date | Country | Kind |
---|---|---|---|
5-283797 | Nov 1993 | JPX | |
5-317587 | Dec 1993 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4000842 | Burns | Jan 1977 | |
4263606 | Yorikane | Apr 1981 | |
4742023 | Hasegawa | May 1988 | |
4818728 | Rai et al. | Apr 1989 | |
4970571 | Yamakawa et al. | Nov 1990 | |
5289631 | Koopman et al. | Mar 1994 |
Number | Date | Country |
---|---|---|
1-143291 | Jun 1989 | JPX |
Entry |
---|
Y. Tomura et al., "Chip-On-Board Mounting Technology Using Stud-Bump-Bonding Technique", National Technical Report, vol. 39, No. 2, Apr. 1993, pp. 90-97. |
"Flip Chip Mounting Using Stud Bumps and Adhesives for Encapsulation", Fujitsu, vol. 43, No. 7, Nov. 1992, pp. 773-778 with English-Language Abstract. |