Masanori Yoshimoto

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the device
- Patent number 5,920,117
- Issue date Jul 6, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,861,669
- Issue date Jan 19, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,831,332
- Issue date Nov 3, 1998
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit
- Patent number 5,786,985
- Issue date Jul 28, 1998
- Fujitsu Limited
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a single in-line package for surface moun...
- Patent number 5,728,601
- Issue date Mar 17, 1998
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device unit having holder
- Patent number 5,684,675
- Issue date Nov 4, 1997
- Fujitsu, Ltd.
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiator structure
- Patent number 5,659,200
- Issue date Aug 19, 1997
- Fujitsu, Ltd.
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device affixed to an upper and a lower leadframe
- Patent number 5,637,915
- Issue date Jun 10, 1997
- Fujitsu Ltd.
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting with reinforcing members...
- Patent number 5,574,310
- Issue date Nov 12, 1996
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single in-line package for surface mounting
- Patent number 5,446,317
- Issue date Aug 29, 1995
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for encapsulating a semiconductor package having a heat sin...
- Patent number 5,444,025
- Issue date Aug 22, 1995
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor device affixed to an uppe...
- Patent number 5,409,866
- Issue date Apr 25, 1995
- Fujitsu Ltd.
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a process for making same having improved...
- Patent number 5,343,615
- Issue date Sep 6, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mounting type semiconductor package having an improved effi...
- Patent number 5,305,179
- Issue date Apr 19, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing a semiconductor device
- Patent number 5,293,064
- Issue date Mar 8, 1994
- Fujitsu Limited
- Masanori Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS

Masanori Yoshimoto

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming the device

Semiconductor package for surface mounting

Semiconductor package for surface mounting

Semiconductor device and semiconductor device unit

Process for manufacturing a single in-line package for surface moun...

Semiconductor device unit having holder

Semiconductor device having radiator structure

Semiconductor device affixed to an upper and a lower leadframe

Semiconductor package for surface mounting with reinforcing members...

Single in-line package for surface mounting

Process for encapsulating a semiconductor package having a heat sin...

Process for manufacturing a semiconductor device affixed to an uppe...

Semiconductor device and a process for making same having improved...

Surface-mounting type semiconductor package having an improved effi...

Lead frame and method of manufacturing a semiconductor device