Masao Kawasumi

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Hitachi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed semiconductor device, and die bonding material and sea...
- Patent number 6,774,501
- Issue date Aug 10, 2004
- Hitachi Chemical Co., Ltd.
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin and adhesive composition containing the same
- Patent number 5,350,811
- Issue date Sep 27, 1994
- Hitachi Chemical Co. Ltd.
- Nobuo Ichimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin and adhesive composition containing the same
- Patent number 5,258,139
- Issue date Nov 2, 1993
- Hitachi Chemical Company, Ltd.
- Nobuo Ichimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electroconductive resin paste containing mixed epoxy resin and elec...
- Patent number 5,188,767
- Issue date Feb 23, 1993
- Hitachi Chemical Co., Ltd.
- Mitsuo Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Resin Paste For Die Bonding And Its Use
- Publication number 20070290369
- Publication date Dec 20, 2007
- HITACHI CHEMICAL CO., LTD.
- Yuji Hasegawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-sealed semiconductor device, and die bonding material and sea...
- Publication number 20040000728
- Publication date Jan 1, 2004
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...