Masao Sekibata

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Kunitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer plating method and multilayer plated film
- Patent number 4,910,094
- Issue date Mar 20, 1990
- Hitachi, Ltd.
- Tetsuya Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating process for an electronic part
- Patent number 4,765,528
- Issue date Aug 23, 1988
- Hitachi, Ltd.
- Masao Sekibata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric component part having lead terminals
- Patent number 4,739,125
- Issue date Apr 19, 1988
- Hitachi, Ltd.
- Yutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device structure including getter material f...
- Patent number 4,630,095
- Issue date Dec 16, 1986
- Vlsi Technology Research Association
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding an aluminum wire
- Patent number 4,580,713
- Issue date Apr 8, 1986
- Hitachi, Ltd.
- Masao Sekibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an alpha-particle shield
- Patent number 4,541,003
- Issue date Sep 10, 1985
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS