Masaru Naito

Person

Hamamatsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming wiring layer
- Patent number 6,060,390
- Issue date May 9, 2000
- Yamaha Corporation
- Masaru Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating multi-layered wiring
- Patent number 5,997,754
- Issue date Dec 7, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of suppressing cracks in the insulating...
- Patent number 5,885,857
- Issue date Mar 23, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of supressing cracks in insulating layer
- Patent number 5,763,936
- Issue date Jun 9, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making aluminum alloy wiring with less silicon nodule
- Patent number 5,750,439
- Issue date May 12, 1998
- Yamaha Corporation
- Masaru Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing aluminum wiring at a substrate temperature...
- Patent number 5,705,429
- Issue date Jan 6, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC with multilayered Al wiring
- Patent number 5,641,993
- Issue date Jun 24, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring structure having continuous grain boundaries
- Patent number 5,428,251
- Issue date Jun 27, 1995
- Yamaha Corporation
- Masaru Naito
- H01 - BASIC ELECTRIC ELEMENTS

Masaru Naito

Person

Patents Grantslast 30 patents

Method of forming wiring layer

Method of fabricating multi-layered wiring

Semiconductor chip capable of suppressing cracks in the insulating...

Semiconductor chip capable of supressing cracks in insulating layer

Method of making aluminum alloy wiring with less silicon nodule

Method of manufacturing aluminum wiring at a substrate temperature...

Semiconductor IC with multilayered Al wiring

Multi-layer wiring structure having continuous grain boundaries