Masaru Seita

Person

Ina, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming resin composite material
- Patent number 6,899,781
- Issue date May 31, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper plating solution and method for controlling the...
- Patent number 6,881,319
- Issue date Apr 19, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing copper-resin composite material
- Patent number 6,740,425
- Issue date May 25, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating using a reducing agent
- Patent number 5,454,930
- Issue date Oct 3, 1995
- LeaRonal Japan Inc.
- Takeshi Miura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Immersion tin/lead alloy plating bath
- Patent number 5,302,256
- Issue date Apr 12, 1994
- LeaRonal Japan Inc.
- Takeshi Miura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Composite material with improved binding strength and method for fo...
- Publication number 20050164020
- Publication date Jul 28, 2005
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formaldehyde-free electroless copper plating process and solution f...
- Publication number 20040253450
- Publication date Dec 16, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Resin composite material and method of forming the same
- Publication number 20040170846
- Publication date Sep 2, 2004
- Masaru Seita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Direct patterning method
- Publication number 20040101665
- Publication date May 27, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Composite material with improved binding strength and method for fo...
- Publication number 20040072015
- Publication date Apr 15, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electroplating method using insoluble anode
- Publication number 20040050706
- Publication date Mar 18, 2004
- Masaru Seita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for forming resin composite material
- Publication number 20040001957
- Publication date Jan 1, 2004
- Shipley Company, L.L.C.
- Masaru Seita
- B32 - LAYERED PRODUCTS
Information Patent Application
Process for electroplating silicon wafers
- Publication number 20030155247
- Publication date Aug 21, 2003
- Shipley Company, L.L.C.
- Takeshi Miura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic copper plating solution and method for controlling the...
- Publication number 20030094376
- Publication date May 22, 2003
- Shipley Company, L.L.C.
- Masaru Seita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for manufacturing copper-resin composite material
- Publication number 20030066754
- Publication date Apr 10, 2003
- Shipley Company, L.L.C.
- Masaru Seita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Masaru Seita

Person

Patents Grantslast 30 patents

Method for forming resin composite material

Electrolytic copper plating solution and method for controlling the...

Method for manufacturing copper-resin composite material

Electrolytic copper plating using a reducing agent

Immersion tin/lead alloy plating bath

Patents Applicationslast 30 patents

Composite material with improved binding strength and method for fo...

Formaldehyde-free electroless copper plating process and solution f...

Resin composite material and method of forming the same

Direct patterning method

Composite material with improved binding strength and method for fo...

Copper electroplating method using insoluble anode

Method for forming resin composite material

Process for electroplating silicon wafers

Electrolytic copper plating solution and method for controlling the...

Method for manufacturing copper-resin composite material