Masataka Mizukoshi

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device with bristled conductiv...
- Patent number 8,735,274
- Issue date May 27, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Ferroelectric component and manufacturing the same
- Patent number 8,704,106
- Issue date Apr 22, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,479,386
- Issue date Jul 9, 2013
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,409,931
- Issue date Apr 2, 2013
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,293,577
- Issue date Oct 23, 2012
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 8,216,934
- Issue date Jul 10, 2012
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 8,058,110
- Issue date Nov 15, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for fabricating the same
- Patent number 7,935,573
- Issue date May 3, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,927,998
- Issue date Apr 19, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 7,884,459
- Issue date Feb 8, 2011
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing the same
- Patent number 7,863,524
- Issue date Jan 4, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing capacitor embedded in interposer
- Patent number 7,846,852
- Issue date Dec 7, 2010
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,830,009
- Issue date Nov 9, 2010
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,816,180
- Issue date Oct 19, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,811,835
- Issue date Oct 12, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film capacitor and method of manufacturing the same
- Patent number 7,778,009
- Issue date Aug 17, 2010
- Fujitsu Limited
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor embedded in interposer, semiconductor device including th...
- Patent number 7,745,924
- Issue date Jun 29, 2010
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,704,856
- Issue date Apr 27, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,670,940
- Issue date Mar 2, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,648,907
- Issue date Jan 19, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chips mounted on mounting b...
- Patent number 7,633,148
- Issue date Dec 15, 2009
- Fujitsu Limited
- Yuji Awano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an interposer
- Patent number 7,614,142
- Issue date Nov 10, 2009
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,514,295
- Issue date Apr 7, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,485,962
- Issue date Feb 3, 2009
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 7,432,114
- Issue date Oct 7, 2008
- Fujitsu Limited
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of connecting base materials
- Patent number 7,402,461
- Issue date Jul 22, 2008
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for fabricating the same
- Patent number 7,355,290
- Issue date Apr 8, 2008
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating semiconductor device and semiconductor device
- Patent number 7,049,229
- Issue date May 23, 2006
- Fujitsu Limited
- Koji Omote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic circuit component
- Patent number 6,979,644
- Issue date Dec 27, 2005
- Fujitsu Limited
- Koji Omote
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120244665
- Publication date Sep 27, 2012
- FUJITSU LIMITED
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110220397
- Publication date Sep 15, 2011
- FUJITSU LIMITED
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20110168564
- Publication date Jul 14, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20110092065
- Publication date Apr 21, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Eiji YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20110056068
- Publication date Mar 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20110021016
- Publication date Jan 27, 2011
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE WITH BRISTLED CONDUCTIV...
- Publication number 20100261343
- Publication date Oct 14, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER
- Publication number 20100233359
- Publication date Sep 16, 2010
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20100112775
- Publication date May 6, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100093133
- Publication date Apr 15, 2010
- FUJITSU LIMITED
- Masataka Mizukoshi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WIT...
- Publication number 20090291525
- Publication date Nov 26, 2009
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A BASE
- Publication number 20090181497
- Publication date Jul 16, 2009
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A BASE
- Publication number 20090176331
- Publication date Jul 9, 2009
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...
- Publication number 20090057827
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20090008798
- Publication date Jan 8, 2009
- Fujitsu Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20080169563
- Publication date Jul 17, 2008
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20080134499
- Publication date Jun 12, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20080073110
- Publication date Mar 27, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070287282
- Publication date Dec 13, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chips mounted on mounting b...
- Publication number 20070267735
- Publication date Nov 22, 2007
- FUJITSU LIMITED
- Yuji Awano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20070231961
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Kazuo Teshirogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070184646
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-film capacitor and method of manufacturing the same
- Publication number 20070176175
- Publication date Aug 2, 2007
- FUJITSU LIMITED
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20070090546
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method for fabricating the same
- Publication number 20060220220
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for fabricating the same
- Publication number 20060170089
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Masataka Mizukoshi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Plating method, semiconductor device fabrication method and circuit...
- Publication number 20060084253
- Publication date Apr 20, 2006
- FUJITSU LIMITED
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating method, semiconductor device fabrication method and circuit...
- Publication number 20060084251
- Publication date Apr 20, 2006
- FUJITSU LIMITED
- Kanae Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masataka Mizukoshi

Person

Patents Grantslast 30 patents

Method for forming bumps, semiconductor device and method for manuf...

Manufacture method for semiconductor device with bristled conductiv...

Ferroelectric component and manufacturing the same

Method for manufacturing interposer

Method of manufacturing semiconductor device

Semiconductor package and method of manufacturing the same

Semiconductor device suitable for a stacked structure

Plating method, semiconductor device fabrication method and circuit...

Electronic device and method for fabricating the same

Plating method, semiconductor device fabrication method and circuit...

Semiconductor device suitable for a stacked structure

Interposer and method for manufacturing the same

Method for manufacturing capacitor embedded in interposer

Semiconductor package and method of manufacturing the same

Method for processing a base that includes connecting a first base...

Method for processing a base that includes connecting a first base...

Thin-film capacitor and method of manufacturing the same

Capacitor embedded in interposer, semiconductor device including th...

Semiconductor device, wiring substrate forming method, and substrat...

Plating method, semiconductor device fabrication method and circuit...

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device with semiconductor chips mounted on mounting b...

Method for fabricating an interposer

Method for processing a base that includes connecting a first base...

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device manufacturing method

Method of connecting base materials

Interposer and method for fabricating the same

Method of fabricating semiconductor device and semiconductor device

Method of manufacturing electronic circuit component

Patents Applicationslast 30 patents

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

Interposer and method for manufacturing the same

Semiconductor package and method of manufacturing the same

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE WITH BRISTLED CONDUCTIV...

METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WIT...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

METHOD FOR PROCESSING A BASE

METHOD FOR PROCESSING A BASE

CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

Semiconductor package and method of manufacturing the same

Interposer and method for fabricating the same

Interposer and method for manufacturing the same

Semiconductor device, wiring substrate forming method, and substrat...

Semiconductor device with semiconductor chips mounted on mounting b...

Semiconductor device manufacturing method

Semiconductor device, wiring substrate forming method, and substrat...

Thin-film capacitor and method of manufacturing the same

Interposer and method for fabricating the same

Electronic device and method for fabricating the same

Electronic device and method for fabricating the same

Plating method, semiconductor device fabrication method and circuit...

Plating method, semiconductor device fabrication method and circuit...