Semiconductor device manufacturing method

Abstract

To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumps 34 on at least one of first and second bases 10A and 40 to be bonded together at their corresponding electrodes (e.g., electrodes 15 and electrodes 41); aligning the electrodes 15 of the first base 10A to positions corresponding to the electrodes 41 of the second base 40 for connection, by means of magnetic forces of the magnetic bumps 34 formed over the first base 10A; and connecting the electrodes 15 of the first base 10A to the electrodes 41 of the second base 40, wherein the alignment is made for a plurality of the first bases 10A at a time.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a step view showing the first bump formation step in a semiconductor device manufacturing method.

FIG. 1B is a step view showing the second bump formation step in the semiconductor device manufacturing method.

FIG. 1C is a step view showing the third bump formation step in the semiconductor device manufacturing method.

FIG. 1D is a step view showing the fourth bump formation step in the semiconductor device manufacturing method.

FIG. 1E is a step view showing the fifth bump formation step in the semiconductor device manufacturing method.

FIG. 1F is a step view showing the sixth bump formation step in the semiconductor device manufacturing method.

FIG. 1G is a step view showing the seventh bump formation step in the semiconductor device manufacturing method.

FIG. 1H is a step view showing the eighth bump formation step in the semiconductor device manufacturing method.

FIG. 1I is a step view showing the ninth bump formation step in the semiconductor device manufacturing method.

FIG. 1J is a step view showing the tenth bump formation step in the semiconductor device manufacturing method.

FIG. 2A is a perspective view showing the first step in First Example of the semiconductor device manufacturing method.

FIG. 2B is a vertical cross-sectional view showing the first step in First Example of the semiconductor device manufacturing method.

FIG. 2C is an enlarged vertical cross-sectional view showing a separate semiconductor chip in FIG. 2B.

FIG. 2D is a perspective view showing the second step in First Example of the semiconductor device manufacturing method.

FIG. 2E is a vertical cross-sectional view showing the second step in First Example of the semiconductor device manufacturing method.

FIG. 2F is a perspective view showing the third step in First Example of the semiconductor device manufacturing method.

FIG. 2G is a perspective view showing the fourth step in First Example of the semiconductor device manufacturing method.

FIG. 2H is a vertical cross-sectional view showing the fourth step in First Example of the semiconductor device manufacturing method.

FIG. 2I is a perspective view showing the fifth step in First Example of the semiconductor device manufacturing method.

FIG. 2J is a vertical cross-sectional view showing the fifth step in First Example of the semiconductor device manufacturing method.

FIG. 2K is an enlarged vertical cross-sectional view showing a separate semiconductor chip in FIG. 2J.

FIG. 2L is a perspective view showing the sixth step in First Example of the semiconductor device manufacturing method.

FIG. 2M is a vertical cross-sectional view showing the sixth step in First Example of the semiconductor device manufacturing method.

FIG. 2N is a perspective view showing the seventh step in First Example of the semiconductor device manufacturing method.

FIG. 2O is a perspective view showing the eighth step in First Example of the semiconductor device manufacturing method.

FIG. 3A is a schematic vertical cross-sectional view showing an example of a semiconductor device manufactured using he semiconductor device manufacturing method in First Example.

FIG. 3B is a schematic vertical cross-sectional view showing the first modification of a semiconductor device manufactured using the semiconductor device manufacturing method in First Example.

FIG. 3C is a schematic vertical cross-sectional view showing the second modification of a semiconductor device manufactured using the semiconductor device manufacturing method in First Example.

FIG. 3D is a schematic vertical cross-sectional view showing the third modification of a semiconductor device manufactured using the semiconductor device manufacturing method in First Example 1.

FIG. 4A is a perspective view showing the first step in Second Example of the semiconductor device manufacturing method.

FIG. 4B is a vertical cross-sectional view showing the first step in Second Example of the semiconductor device manufacturing method.

FIG. 4C is an enlarged vertical cross-sectional view showing a separate semiconductor chip in FIG. 4B.

FIG. 4D is a perspective view showing the second step in Second Example of the semiconductor device manufacturing method.

FIG. 4E is a vertical cross-sectional view showing the second step in Second Example of the semiconductor device manufacturing method.

FIG. 4F is a perspective view showing the third step in Second Example of the semiconductor device manufacturing method.

FIG. 4G is a vertical cross-sectional view showing the third step in Second Example of the semiconductor device manufacturing method.

FIG. 4H is an enlarged vertical cross-sectional view showing a separate semiconductor chip in FIG. 4G.

FIG. 4I is a perspective view showing the fourth step in Second Example of the semiconductor device manufacturing method.

FIG. 4J is a vertical cross-sectional view showing the fourth step in Second Example of the semiconductor device manufacturing method.

FIG. 4K is a perspective view showing the fifth step in Second Example of the semiconductor device manufacturing method.

FIG. 4L is a vertical cross-sectional view showing the fifth step in Second Example of the semiconductor device manufacturing method.

FIG. 4M is an enlarged vertical cross-sectional view showing a separate semiconductor chip in FIG. 4L.

FIG. 4N is a perspective view showing the sixth step in Second Example of the semiconductor device manufacturing method.

FIG. 4O is a vertical cross-sectional view showing the sixth step in Second Example of the semiconductor device manufacturing method.

FIG. 4P is a perspective view showing the seventh step in Second Example of the semiconductor device manufacturing method.

FIG. 4Q is a vertical cross-sectional view showing the seventh step in Second Example of the semiconductor device manufacturing method.

FIG. 4R is a perspective view showing the eighth step in Second Example of the semiconductor device manufacturing method.

FIG. 4S is a perspective view showing the ninth step in Second Example of the semiconductor device manufacturing method.

FIG. 5A is a perspective view showing the first step in Third Example of the semiconductor device manufacturing method.

FIG. 5B is a perspective view showing the second step in Third Example of the semiconductor device manufacturing method.

FIG. 5C is a perspective view showing the third step in Third Example of the semiconductor device manufacturing method.

FIG. 5D is a perspective view showing the fourth step in Third Example of the semiconductor device manufacturing method.

FIG. 5E is a perspective view showing the fifth step in Third Example of the semiconductor device manufacturing method.

FIG. 5F is a vertical cross-sectional view showing the fifth step in Third Example of the semiconductor device manufacturing method.

FIG. 6A is a top view showing an example of application of a semiconductor device manufactured using the semiconductor device manufacturing method in Third Example.

FIG. 6B is an enlarged vertical cross-sectional view showing a sensor chip in the X portion encircled by a dotted line of FIG. 6A.

FIG. 7A is a schematic vertical cross-sectional view showing a semiconductor device manufactured using a conventional semiconductor device manufacturing method.

FIG. 7B is a perspective view showing the first step in an example of the conventional semiconductor device manufacturing method.

FIG. 7C is a perspective view showing the second step in the example of the conventional semiconductor device manufacturing method.

FIG. 7D is a perspective view showing the third step in the example of the conventional semiconductor device manufacturing method.

FIG. 7E is a perspective view showing the fourth step in the example of the conventional semiconductor device manufacturing method.

FIG. 7F is a perspective view showing the fifth step in the example of the conventional semiconductor device manufacturing method.

FIG. 7G is a perspective view showing the sixth step in the example of the conventional semiconductor device manufacturing method.

FIG. 7H is a perspective view showing the seventh step in the example of the conventional semiconductor device manufacturing method.

FIG. 7I is a perspective view showing the eighth step in the example of the conventional semiconductor device manufacturing method.

Claims

1. A semiconductor device manufacturing method, comprising: forming magnetic bumps over at least one of first and second bases which are to be bonded together at their corresponding electrodes;aligning the electrodes of the first base to positions corresponding to the electrodes of the second base for connection, by means of magnetic forces of the magnetic bumps formed over the first base; andconnecting the electrodes of the first base to the electrodes of the second base,wherein the alignment is made for a plurality of the first bases at a time.

2. The semiconductor device manufacturing method according to claim 1, wherein the magnetic forces of the magnetic bumps formed over the first base are exerted by magnetic bumps having magnetization.

3. The semiconductor device manufacturing method according to claim 1, wherein the first base is a semiconductor chip and the second base is one of a semiconductor chip and a circuit board.

4. The semiconductor device manufacturing method according to claim 1, wherein the alignment is made by means of magnetic forces between the magnetic bumps formed over the first base and the magnetic bumps formed over the second base.

5. The semiconductor device manufacturing method according to claim 1, wherein the alignment is made by means of magnetic forces between the magnetic bumps formed over the first base and magnetic bumps formed over a tray.

6. The semiconductor device manufacturing method according to claim 5, wherein a plurality of the first bases is arranged over the tray.

7. The semiconductor device manufacturing method according to claim 6, wherein a plurality of base rows is arranged over the tray, each base row consisting of a plurality of the first bases.

8. The semiconductor device manufacturing method according to claim 7, wherein the electrode connection is performed on a plurality of base rows at a time, each base row consisting of a plurality of the first bases.

9. The semiconductor device manufacturing method according to claim 8, wherein the second base is a rectangular substrate.

10. The semiconductor device manufacturing method according to claim 1, wherein the electrode connection is performed for each base row consisting of a plurality of the first bases.

11. The semiconductor device manufacturing method according to claim 10, wherein the second base is a band-shaped substrate.

12. The semiconductor device manufacturing method according to claim 11, wherein the first base is wound on a reel together with the second base, with their corresponding electrodes connected together upon the electrode connection.