Masatake Nakano

Person

Annaka-shi Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,424,484
- Issue date Sep 24, 2019
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer, semiconductor device, and method for manufacturing SOI w...
- Patent number 8,466,538
- Issue date Jun 18, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bonded wafer
- Patent number 7,531,425
- Issue date May 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an SOI wafer where COP's are eliminated wit...
- Patent number 7,186,628
- Issue date Mar 6, 2007
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for bonded substrates
- Patent number 6,959,854
- Issue date Nov 1, 2005
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer and bonded wafer
- Patent number 6,900,113
- Issue date May 31, 2005
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer producing method and bonded wafer
- Patent number 6,797,632
- Issue date Sep 28, 2004
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Patent number 6,720,640
- Issue date Apr 13, 2004
- Shin-Etsu Handotai Co., Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Patent number 6,596,610
- Issue date Jul 22, 2003
- Shin-Etsu Handotai Co. Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer including heat treatment in an o...
- Patent number 6,534,384
- Issue date Mar 18, 2003
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide film on an SOI layer and method of fabricat...
- Patent number 6,239,004
- Issue date May 29, 2001
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer and bonded wafer manufactured...
- Patent number 6,004,866
- Issue date Dec 21, 1999
- Shin-Etsu Handotai, Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for production of extremely thin SOI film subs...
- Patent number 5,427,052
- Issue date Jun 27, 1995
- Shin-Etsu Handotai Co., Ltd.
- Yutaka Ohta
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for production of extremely thin SOI film substrate
- Patent number 5,376,215
- Issue date Dec 27, 1994
- Shin-Etsu Handotai Co., Ltd.
- Yutaka Ohta
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating SOI substrate with uniform thin silicon film
- Patent number 5,240,883
- Issue date Aug 31, 1993
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170345663
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170040210
- Publication date Feb 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taishi WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...
- Publication number 20100314722
- Publication date Dec 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soi wafer manufacturing method and soi wafer
- Publication number 20050032331
- Publication date Feb 10, 2005
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for silicon wafer and soi wafer, and soi wafer
- Publication number 20050020030
- Publication date Jan 27, 2005
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for bonded substrates
- Publication number 20040035525
- Publication date Feb 26, 2004
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Publication number 20030219957
- Publication date Nov 27, 2003
- Shin-Etsu Handotai Co., Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer and bonded wafer
- Publication number 20030153162
- Publication date Aug 14, 2003
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING SOI WAFER AND SOI WAFER
- Publication number 20010055863
- Publication date Dec 27, 2001
- MASATAKE NAKANO
- H01 - BASIC ELECTRIC ELEMENTS

Masatake Nakano

Person

Patents Grantslast 30 patents

Method for manufacturing a bonded SOI wafer

SOI wafer, semiconductor device, and method for manufacturing SOI w...

Method of fabricating bonded wafer

Method of manufacturing an SOI wafer where COP's are eliminated wit...

Production method for bonded substrates

Method for producing bonded wafer and bonded wafer

Bonded wafer producing method and bonded wafer

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method for manufacturing SOI wafer including heat treatment in an o...

Method of forming oxide film on an SOI layer and method of fabricat...

Method for manufacturing bonded wafer and bonded wafer manufactured...

Method and apparatus for production of extremely thin SOI film subs...

Apparatus for production of extremely thin SOI film substrate

Method of fabricating SOI substrate with uniform thin silicon film

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A BONDED SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...

Soi wafer manufacturing method and soi wafer

Production method for silicon wafer and soi wafer, and soi wafer

Production method for bonded substrates

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method for producing bonded wafer and bonded wafer

METHODS FOR MANUFACTURING SOI WAFER AND SOI WAFER