Masateru Koide

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,317,520
- Issue date Apr 26, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Masaharu Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing board
- Patent number 10,396,020
- Issue date Aug 27, 2019
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and method of manufacturing package substrate
- Patent number 10,181,437
- Issue date Jan 15, 2019
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 9,699,887
- Issue date Jul 4, 2017
- Fujitsu Limited
- Daisuke Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package mounting structure
- Patent number 9,515,005
- Issue date Dec 6, 2016
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device mounting structure
- Patent number 8,866,270
- Issue date Oct 21, 2014
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module and method for manufacturing the same
- Patent number 8,811,031
- Issue date Aug 19, 2014
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,740,047
- Issue date Jun 3, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting structure, method of manufacturing th...
- Patent number 8,716,839
- Issue date May 6, 2014
- Fujitsu Limited
- Manabu Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,556,157
- Issue date Oct 15, 2013
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part and method of manufacturing the same
- Patent number 8,546,187
- Issue date Oct 1, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 8,446,020
- Issue date May 21, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and method of manufacturing the same
- Patent number 8,368,230
- Issue date Feb 5, 2013
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect board, printed circuit board unit, and method
- Patent number 8,289,728
- Issue date Oct 16, 2012
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection substrate and manufacturing method therefor
- Patent number 7,915,541
- Issue date Mar 29, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a thin-film layer configured to accommodate a pa...
- Patent number 7,301,230
- Issue date Nov 27, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,291,901
- Issue date Nov 6, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,268,002
- Issue date Sep 11, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply connection structure to a semiconductor device
- Patent number 7,057,272
- Issue date Jun 6, 2006
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for laser cutting wiring in accordance with a measured si...
- Patent number 5,670,067
- Issue date Sep 23, 1997
- Fujitsu Limited
- Masateru Koide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of wirebond pad repair and reuse
- Patent number 5,550,083
- Issue date Aug 27, 1996
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reformed pad
- Patent number 5,455,461
- Issue date Oct 3, 1995
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190053385
- Publication date Feb 14, 2019
- Fujitsu Limited
- Masaharu Furuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20180358289
- Publication date Dec 13, 2018
- Fujitsu Limited
- MANABU WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD AND METHOD OF MANUFACTURING BOARD
- Publication number 20180315687
- Publication date Nov 1, 2018
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MOUNTING STRUCTURE
- Publication number 20140376187
- Publication date Dec 25, 2014
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20140293566
- Publication date Oct 2, 2014
- Fujitsu Limited
- Daisuke Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
- Publication number 20140193953
- Publication date Jul 10, 2014
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20140008114
- Publication date Jan 9, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...
- Publication number 20130341767
- Publication date Dec 26, 2013
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20110220398
- Publication date Sep 15, 2011
- Fujitsu Limited
- Seiki Sakuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20110089579
- Publication date Apr 21, 2011
- Fujitsu Limited
- Masateru KOIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
- Publication number 20110080717
- Publication date Apr 7, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
- Publication number 20110080718
- Publication date Apr 7, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042806
- Publication date Feb 24, 2011
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042824
- Publication date Feb 24, 2011
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110044015
- Publication date Feb 24, 2011
- Fujitsu Limited
- Masateru KOIDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE
- Publication number 20090079062
- Publication date Mar 26, 2009
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER INTERCONNECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20080192453
- Publication date Aug 14, 2008
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070262427
- Publication date Nov 15, 2007
- Fujitsu Limited
- Masateru Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat conductive bonding material, semiconductor package, heat sprea...
- Publication number 20070228530
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Toshihisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging method, packaging structure and package substrate for ele...
- Publication number 20060063303
- Publication date Mar 23, 2006
- FUJITSU LIMITED
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate manufacturing method and circuit board
- Publication number 20060056162
- Publication date Mar 16, 2006
- FUJITSU LIMITED
- Masateru Koide
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power supply connection structure to a semiconductor device
- Publication number 20050146017
- Publication date Jul 7, 2005
- FUJITSU LIMITED
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging method, packaging structure and package substrate for ele...
- Publication number 20040183193
- Publication date Sep 23, 2004
- FUJITSU LIMITED
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masateru Koide

Person

Patents Grantslast 30 patents

Circuit board, method of manufacturing circuit board, and electroni...

Method of manufacturing board

Package substrate and method of manufacturing package substrate

Circuit board and electronic device

Package mounting structure

Method of manufacturing semiconductor device mounting structure

Multichip module and method for manufacturing the same

Method of manufacturing electronic apparatus, electronic component-...

Semiconductor device mounting structure, method of manufacturing th...

Method of manufacturing electronic apparatus, electronic component-...

Electronic part and method of manufacturing the same

Multi-chip module

Electronic part and method of manufacturing the same

Interconnect board, printed circuit board unit, and method

Multilayer interconnection substrate and manufacturing method therefor

Circuit board with a thin-film layer configured to accommodate a pa...

Packaging method, packaging structure and package substrate for ele...

Packaging method, packaging structure and package substrate for ele...

Power supply connection structure to a semiconductor device

Apparatus for laser cutting wiring in accordance with a measured si...

Process of wirebond pad repair and reuse

Semiconductor device having reformed pad

Patents Applicationslast 30 patents

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE

BOARD AND METHOD OF MANUFACTURING BOARD

PACKAGE MOUNTING STRUCTURE

CIRCUIT BOARD AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

MULTI-CHIP MODULE

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME

MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME

MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

MULTILAYER INTERCONNECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

Heat conductive bonding material, semiconductor package, heat sprea...

Packaging method, packaging structure and package substrate for ele...

Substrate manufacturing method and circuit board

Power supply connection structure to a semiconductor device

Packaging method, packaging structure and package substrate for ele...