Masato Hamada

Person

Nirasaki City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic processing jig and electrolytic processing method
- Patent number 11,542,627
- Issue date Jan 3, 2023
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic treatment apparatus and electrolytic treatment method
- Patent number 11,427,921
- Issue date Aug 30, 2022
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic processing jig and electrolytic processing method
- Patent number 11,427,920
- Issue date Aug 30, 2022
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing apparatus and manufacturing method for semiconductor...
- Patent number 11,111,592
- Issue date Sep 7, 2021
- Tokyo Electron Limited
- Tomohisa Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 10,903,081
- Issue date Jan 26, 2021
- Tokyo Electron Limited
- Tomohisa Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic treatment apparatus and electrolytic treatment method
- Patent number 10,392,719
- Issue date Aug 27, 2019
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adhesion layer forming method, adhesion layer forming system and re...
- Patent number 10,354,915
- Issue date Jul 16, 2019
- Tokyo Electron Limited
- Tomohisa Hoshino
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230096305
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Masato Hamada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20230042744
- Publication date Feb 9, 2023
- TOKYO ELECTRON LIMITED
- Masato Hamada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC TREATMENT APPARATUS AND ELECTROLYTIC TREATMENT METHOD
- Publication number 20210285119
- Publication date Sep 16, 2021
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC PROCESSING JIG AND ELECTROLYTIC PROCESSING METHOD
- Publication number 20190233963
- Publication date Aug 1, 2019
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC PROCESSING JIG AND ELECTROLYTIC PROCESSING METHOD
- Publication number 20190218682
- Publication date Jul 18, 2019
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
- Publication number 20180355501
- Publication date Dec 13, 2018
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20180122641
- Publication date May 3, 2018
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...
- Publication number 20170167029
- Publication date Jun 15, 2017
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...
- Publication number 20170170021
- Publication date Jun 15, 2017
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC TREATMENT APPARATUS AND ELECTROLYTIC TREATMENT METHOD
- Publication number 20170159202
- Publication date Jun 8, 2017
- TOKYO ELECTRON LIMITED
- Tomohisa HOSHINO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RE...
- Publication number 20160284592
- Publication date Sep 29, 2016
- TOKYO ELECTRON LIMITED
- Tomohisa Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Masato Hamada

Person

Patents Grantslast 30 patents

Electrolytic processing jig and electrolytic processing method

Electrolytic treatment apparatus and electrolytic treatment method

Electrolytic processing jig and electrolytic processing method

Manufacturing apparatus and manufacturing method for semiconductor...

Substrate processing method

Electrolytic treatment apparatus and electrolytic treatment method

Adhesion layer forming method, adhesion layer forming system and re...

Patents Applicationslast 30 patents

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

PLATING APPARATUS

PLATING METHOD AND PLATING APPARATUS

ELECTROLYTIC TREATMENT APPARATUS AND ELECTROLYTIC TREATMENT METHOD

ELECTROLYTIC PROCESSING JIG AND ELECTROLYTIC PROCESSING METHOD

ELECTROLYTIC PROCESSING JIG AND ELECTROLYTIC PROCESSING METHOD

MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND REC...

ELECTROLYTIC TREATMENT APPARATUS AND ELECTROLYTIC TREATMENT METHOD

ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RE...