Masato Hirano

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for mounting electronic component
- Patent number RE44384
- Issue date Jul 23, 2013
- Panasonic Corporation
- Masato Hirano
- 029 - Metal working
Information Patent Grant
Circuit board and method for mounting chip component
- Patent number 7,667,299
- Issue date Feb 23, 2010
- Panasonic Corporation
- Masato Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for recycling wastes of an electrical appliance
- Patent number 7,540,078
- Issue date Jun 2, 2009
- Panasonic Corporation
- Kenichiro Suetsugu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Soldering method, component to be joined by the soldering method, a...
- Patent number 7,473,476
- Issue date Jan 6, 2009
- Panasonic Corporation
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory module having built-in antenna
- Patent number 7,471,260
- Issue date Dec 30, 2008
- Panasonic Corporation
- Shozo Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for flow soldering
- Patent number 7,150,387
- Issue date Dec 19, 2006
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for soldering and connecting structure
- Patent number 6,871,775
- Issue date Mar 29, 2005
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mounting electronic component
- Patent number 6,708,402
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masato Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering using lead-free solder and bonded article prepa...
- Patent number 6,702,175
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Matsushige
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus for flow soldering
- Patent number 6,648,216
- Issue date Nov 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mounting electronic component
- Patent number 6,493,931
- Issue date Dec 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masato Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mounting electronic component
- Patent number 6,230,393
- Issue date May 15, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masato Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting electronic component
- Patent number 5,868,302
- Issue date Feb 9, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Onishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronics component
- Patent number 5,743,007
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Onishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLI...
- Publication number 20080210604
- Publication date Sep 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Memory Module Having Built-In Antenna
- Publication number 20080111756
- Publication date May 15, 2008
- Shozo Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting method, and circuit substrate and cir...
- Publication number 20070164079
- Publication date Jul 19, 2007
- Matsushita Electric Industrial Co., Ltd.
- Masato Mori
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Soldering method and method for manufacturing component mounting board
- Publication number 20040155097
- Publication date Aug 12, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method, component to be joined by the soldering method, a...
- Publication number 20040155336
- Publication date Aug 12, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of soldering lead-free solder, and joined object soldered by...
- Publication number 20040144829
- Publication date Jul 29, 2004
- Kazumi Matsushige
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and apparatus for flow soldering
- Publication number 20040056067
- Publication date Mar 25, 2004
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for soldering and connecting structure
- Publication number 20030121959
- Publication date Jul 3, 2003
- Atsushi Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder material and electric or electronic device in which the same...
- Publication number 20030015575
- Publication date Jan 23, 2003
- Atsushi Yamaguchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Process and apparatus for flow soldering
- Publication number 20020038815
- Publication date Apr 4, 2002
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for mounting electronic component
- Publication number 20010010498
- Publication date Aug 2, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masato Hirano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and device for mounting electronic component
- Publication number 20010010120
- Publication date Aug 2, 2001
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masato Hirano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Masato Hirano

Person

Patents Grantslast 30 patents

Method and device for mounting electronic component

Circuit board and method for mounting chip component

Method for recycling wastes of an electrical appliance

Soldering method, component to be joined by the soldering method, a...

Semiconductor memory module having built-in antenna

Process and apparatus for flow soldering

Process for soldering and connecting structure

Method and device for mounting electronic component

Method of soldering using lead-free solder and bonded article prepa...

Process and apparatus for flow soldering

Method and device for mounting electronic component

Method and device for mounting electronic component

Method and apparatus for mounting electronic component

Method of mounting electronics component

Patents Applicationslast 30 patents

ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLI...

Semiconductor Memory Module Having Built-In Antenna

Electronic component mounting method, and circuit substrate and cir...

Soldering method and method for manufacturing component mounting board

Soldering method, component to be joined by the soldering method, a...

Method of soldering lead-free solder, and joined object soldered by...

Process and apparatus for flow soldering

Process for soldering and connecting structure

Solder material and electric or electronic device in which the same...

Process and apparatus for flow soldering

Method and device for mounting electronic component

Method and device for mounting electronic component