Masato Kawade

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit boards
- Patent number 6,303,880
- Issue date Oct 16, 2001
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards
- Patent number 6,291,778
- Issue date Sep 18, 2001
- Ibiden, Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for electroless plating, feedstock composition for prepari...
- Patent number 6,261,671
- Issue date Jul 17, 2001
- Ibiden Co., Ltd.
- Motoo Asai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed circuit board, method of producing multilayer pr...
- Patent number 6,251,502
- Issue date Jun 26, 2001
- Ibiden Co., Ltd.
- Toshihiko Yasue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for electroless plating, raw material composition for prep...
- Patent number 6,248,428
- Issue date Jun 19, 2001
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board, method of producing multilayer pr...
- Patent number 6,217,988
- Issue date Apr 17, 2001
- Ibiden Co., Ltd.
- Toshihiko Yasue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board, method of producing multilayer pr...
- Patent number 6,010,768
- Issue date Jan 4, 2000
- Ibiden Co., Ltd.
- Toshihiko Yasue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method of producing the same
- Patent number 5,827,604
- Issue date Oct 27, 1998
- Ibiden Co., Ltd.
- Hiroaki Uno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masato Kawade

Person

Patents Grantslast 30 patents

Printed circuit boards

Printed circuit boards

Adhesive for electroless plating, feedstock composition for prepari...

Multilayer printed circuit board, method of producing multilayer pr...

Adhesive for electroless plating, raw material composition for prep...

Multilayer printed circuit board, method of producing multilayer pr...

Multilayer printed circuit board, method of producing multilayer pr...

Multilayer printed circuit board and method of producing the same