Claims
- 1. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit including an opening portion exposing the inner layer of the another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit so as to match a position of the viahole with a position of the solder bump, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.
- 2. The printed circuit board of claim 1, wherein the clearance between the opening edge of the solder resist and the outer peripheral edge of the land portion of the viahole is 20-60 μm.
- 3. The printed circuit board of claim 1, wherein the solder resist has a thickness of 15-30 μm.
- 4. The printed circuit board of claim 1, wherein an opening diameter of the viahole is 50-220 μm.
- 5. The printed circuit board of claim 1, wherein the land portion has a diameter of 80-300 μm.
- 6. A printed circuit board comprising a solder bump on a mounting surface, and conductor circuits and interlaminar insulating layers alternatingly laminated on a resin substrate, an interlaminar insulating layer positioned between a surface layer of one conductor circuit and an inner layer of another conductor circuit, and a viahole composed of a metal film electrically connecting the surface layer of the one conductor circuit to the inner layer of the another conductor circuit, a solder bump filling said viahole, and a solder resist having an opening around the viahole so as to form a clearance between an opening edge of the solder resist and an outer peripheral edge of a land portion of the viahole.
- 7. The printed circuit board of claim 6, wherein the clearance between the opening edge of the solder resist and the outer peripheral edge of the land portion of the viahole is 20-60 μm.
- 8. The printed circuit board of claim 6, wherein the solder resist has a thickness of 15-30 μm.
- 9. The printed circuit board of claim 6, wherein an opening diameter of the viahole is 50-220 μm.
- 10. The printed circuit board of claim 6, wherein the land portion has a diameter of 80-300 μm.
Priority Claims (2)
Number |
Date |
Country |
Kind |
7-139501 |
Jun 1995 |
JP |
|
7-144516 |
Jun 1995 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a divisional of application Ser. No. 08/765,451, filed Jan. 22, 1997 which is the U.S. National Stage of International Application No. PCT/JP96/01539, filed Jun. 6, 1996. The entire disclosure of application Ser. No. 08/765,451 is considered as being part of the disclosure of this application, and the entire disclosure of application Ser. No. 08/765,451 is expressly incorporated by reference herein in its entirety.
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Non-Patent Literature Citations (1)
Entry |
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