Masato Takami

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed-wiring board
- Patent number 7,037,597
- Issue date May 2, 2006
- Fukuda Metal Foil & Powder Co., Ltd.
- Masato Takami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of treating copper foil for printed circuits
- Patent number 5,700,362
- Issue date Dec 23, 1997
- Fukuda Metal Foil & Powder Co., Ltd.
- Masami Yano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Foil for a printed circuit
- Patent number 5,567,534
- Issue date Oct 22, 1996
- Fukuda Metal Foil & Powder Co., Ltd.
- Masami Yano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,356,528
- Issue date Oct 18, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,338,619
- Issue date Aug 16, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit boards
- Patent number 5,304,428
- Issue date Apr 19, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Masato Takami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of surface treatment of copper foil for printed circuit boar...
- Patent number 5,234,573
- Issue date Aug 10, 1993
- Fukuda Metal Foil & Powder Co., Ltd.
- Masato Takami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of surface treatment of copper foil or a copper clad laminat...
- Patent number 4,981,560
- Issue date Jan 1, 1991
- Fukuda Metal Foil & Powder Industrial Co., Ltd.
- Toshiyuki Kajihara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for printed circuit board
- Patent number 4,619,871
- Issue date Oct 28, 1986
- Fukuda Metal Foil & Powder Co., Ltd.
- Masato Takami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Masato Takami

Person

Patents Grantslast 30 patents

Copper foil for printed-wiring board

Method of treating copper foil for printed circuits

Foil for a printed circuit

Copper foil for printed circuits and method of producing same

Copper foil for printed circuits and method of producing same

Copper foil for printed circuit boards

Method of surface treatment of copper foil for printed circuit boar...

Method of surface treatment of copper foil or a copper clad laminat...

Copper foil for printed circuit board