Masatoshi Nanjo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer dividing method
- Patent number 7,727,810
- Issue date Jun 1, 2010
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor memory element and met...
- Patent number 7,592,235
- Issue date Sep 22, 2009
- Disco Corporation
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor memory element and met...
- Patent number 7,459,767
- Issue date Dec 2, 2008
- Disco Corporation
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cassette having separation plates for storing a plurality of semico...
- Patent number 7,325,692
- Issue date Feb 5, 2008
- Disco Corporation
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,172,950
- Issue date Feb 6, 2007
- Kansai Paint Co., Ltd.
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer protective device and semiconductor wafer treat...
- Patent number 6,943,045
- Issue date Sep 13, 2005
- Disco Corporation
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer support plate
- Patent number 6,927,416
- Issue date Aug 9, 2005
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 6,869,830
- Issue date Mar 22, 2005
- Disco Corporation
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer dividing method
- Publication number 20070029684
- Publication date Feb 8, 2007
- DISCO CORPORATION
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including semiconductor memory element and met...
- Publication number 20060208329
- Publication date Sep 21, 2006
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including semiconductor memory element and met...
- Publication number 20050255674
- Publication date Nov 17, 2005
- DISCO CORPORATION
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cassette for storing a plurality of semiconductor wafers
- Publication number 20040256284
- Publication date Dec 23, 2004
- Masatoshi Nanjo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer protective device and semiconductor wafer treat...
- Publication number 20040235269
- Publication date Nov 25, 2004
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040192012
- Publication date Sep 30, 2004
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate
- Publication number 20040124413
- Publication date Jul 1, 2004
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a semiconductor wafer
- Publication number 20040092108
- Publication date May 13, 2004
- Kouichi Yajima
- B24 - GRINDING POLISHING
Information Patent Application
Method of processing a semiconductor wafer and substrate for semico...
- Publication number 20030102557
- Publication date Jun 5, 2003
- Masatoshi Nanjo
- B32 - LAYERED PRODUCTS

Masatoshi Nanjo

Person

Patents Grantslast 30 patents

Wafer dividing method

Semiconductor device including semiconductor memory element and met...

Semiconductor device including semiconductor memory element and met...

Cassette having separation plates for storing a plurality of semico...

Method for manufacturing semiconductor chip

Semiconductor wafer protective device and semiconductor wafer treat...

Wafer support plate

Method of processing a semiconductor wafer

Patents Applicationslast 30 patents

Wafer dividing method

Semiconductor device including semiconductor memory element and met...

Semiconductor device including semiconductor memory element and met...

Cassette for storing a plurality of semiconductor wafers

Semiconductor wafer protective device and semiconductor wafer treat...

Method for manufacturing semiconductor chip

Wafer support plate

Method of processing a semiconductor wafer

Method of processing a semiconductor wafer and substrate for semico...