Masaya SEKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and plating process method
- Patent number 12,247,311
- Issue date Mar 11, 2025
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 12,180,606
- Issue date Dec 31, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting method for substrate and plating apparatus
- Patent number 12,152,311
- Issue date Nov 26, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pre-wet module, deaerated liquid circulation system, and pre-wet me...
- Patent number 12,076,760
- Issue date Sep 3, 2024
- Ebara Corporation
- Masaya Seki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, pre-wet process method, and cleaning process method
- Patent number 12,054,840
- Issue date Aug 6, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and film thickness measuring method for substrate
- Patent number 11,906,299
- Issue date Feb 20, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,846,035
- Issue date Dec 19, 2023
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pre-wet module, deaerated liquid circulation system, and pre-wet me...
- Patent number 11,833,551
- Issue date Dec 5, 2023
- Ebara Corporation
- Masaya Seki
- B08 - CLEANING
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,535,949
- Issue date Dec 27, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,511,386
- Issue date Nov 29, 2022
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of removing liquid from seal of a substrate holder
- Patent number 11,230,789
- Issue date Jan 25, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 10,493,588
- Issue date Dec 3, 2019
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,414,013
- Issue date Sep 17, 2019
- Ebara Corporation
- Masaya Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 10,403,505
- Issue date Sep 3, 2019
- Ebara Corporation
- Kenya Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing apparatus for detecting abnormality in polishing of a sub...
- Patent number 10,343,252
- Issue date Jul 9, 2019
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 10,166,647
- Issue date Jan 1, 2019
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 10,155,294
- Issue date Dec 18, 2018
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 10,144,103
- Issue date Dec 4, 2018
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 10,137,552
- Issue date Nov 27, 2018
- Ebara Corporation
- Kazuaki Maeda
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,914,196
- Issue date Mar 13, 2018
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for detecting abnormality in polishing of a substrate
- Patent number 9,782,869
- Issue date Oct 10, 2017
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method of polishing a substrate
- Patent number 9,694,467
- Issue date Jul 4, 2017
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 9,649,739
- Issue date May 16, 2017
- Ebara Corporation
- Kazuaki Maeda
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 9,561,573
- Issue date Feb 7, 2017
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,517,544
- Issue date Dec 13, 2016
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,457,448
- Issue date Oct 4, 2016
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,457,447
- Issue date Oct 4, 2016
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 9,287,158
- Issue date Mar 15, 2016
- Ebara Corporation
- Tamami Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of detecting abnormality in polishing of a substrate and pol...
- Patent number 9,248,543
- Issue date Feb 2, 2016
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250087513
- Publication date Mar 13, 2025
- EBARA CORPORATION
- Masaya SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20240247395
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS
- Publication number 20240247396
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...
- Publication number 20240050992
- Publication date Feb 15, 2024
- EBARA CORPORATION
- Masaya SEKI
- B08 - CLEANING
Information Patent Application
PREWET MODULE AND PREWET METHOD
- Publication number 20240047235
- Publication date Feb 8, 2024
- EBARA CORPORATION
- Masaya SEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
- Publication number 20230167572
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
- Publication number 20230152077
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230151507
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING SOLUTION AGITATING METHOD
- Publication number 20220396896
- Publication date Dec 15, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD
- Publication number 20220396897
- Publication date Dec 15, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...
- Publication number 20220379352
- Publication date Dec 1, 2022
- EBARA CORPORATION
- Masaya SEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HOLDER, SUBSTRATE PLATING DEVICE EQUIPPED THEREWITH, AND...
- Publication number 20220372647
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Masaya SEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND SUBSTRATE HOLDER OPERATION METHOD
- Publication number 20220364255
- Publication date Nov 17, 2022
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING PROCESS METHOD
- Publication number 20220356595
- Publication date Nov 10, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND SUBSTRATE TREATMENT APPARATUS
- Publication number 20220325430
- Publication date Oct 13, 2022
- EBARA CORPORATION
- Masaya SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220267921
- Publication date Aug 25, 2022
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20220178046
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER
- Publication number 20200199769
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20200023486
- Publication date Jan 23, 2020
- EBARA CORPORATION
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20190390359
- Publication date Dec 26, 2019
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20190054589
- Publication date Feb 21, 2019
- EBARA CORPORATION
- Masaya SEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20180169822
- Publication date Jun 21, 2018
- EBARA CORPORATION
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20180076043
- Publication date Mar 15, 2018
- EBARA CORPORATION
- Kenya ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POL...
- Publication number 20170312879
- Publication date Nov 2, 2017
- EBARA CORPORATION
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20170216989
- Publication date Aug 3, 2017
- EBARA CORPORATION
- Kazuaki Maeda
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20170165804
- Publication date Jun 15, 2017
- EBARA CORPORATION
- Masaya SEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20170100813
- Publication date Apr 13, 2017
- EBARA CORPORATION
- Masaya SEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20170072528
- Publication date Mar 16, 2017
- EBARA CORPORATION
- Tamami TAKAHASHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20160172221
- Publication date Jun 16, 2016
- EBARA CORPORATION
- Tamami TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

Masaya SEKI

Person

Patents Grantslast 30 patents

Plating apparatus and plating process method

Plating apparatus

Wetting method for substrate and plating apparatus

Plating apparatus and cleaning method of contact member of plating...

Pre-wet module, deaerated liquid circulation system, and pre-wet me...

Plating apparatus, pre-wet process method, and cleaning process method

Plating apparatus and film thickness measuring method for substrate

Plating apparatus and plating method

Pre-wet module, deaerated liquid circulation system, and pre-wet me...

Substrate holder and plating apparatus

Polishing apparatus and polishing method

Method of removing liquid from seal of a substrate holder

Polishing apparatus and polishing method

Polishing method and polishing apparatus

Substrate processing method and substrate processing apparatus

Polishing apparatus for detecting abnormality in polishing of a sub...

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Polishing apparatus

Polishing apparatus and polishing method

Apparatus for detecting abnormality in polishing of a substrate

Polishing method of polishing a substrate

Polishing apparatus

Polishing apparatus

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Substrate processing apparatus

Method of detecting abnormality in polishing of a substrate and pol...

Patents Applicationslast 30 patents

TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS

PLATING APPARATUS

LEAKAGE DETERMINATION METHOD AND PLATING APPARATUS

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...

PREWET MODULE AND PREWET METHOD

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS

PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE

PLATING APPARATUS

PLATING APPARATUS AND PLATING SOLUTION AGITATING METHOD

PLATING APPARATUS, PRE-WET PROCESS METHOD, AND CLEANING PROCESS METHOD

PRE-WET MODULE, DEAERATED LIQUID CIRCULATION SYSTEM, AND PRE-WET ME...

SUBSTRATE HOLDER, SUBSTRATE PLATING DEVICE EQUIPPED THEREWITH, AND...

PLATING APPARATUS AND SUBSTRATE HOLDER OPERATION METHOD

PLATING APPARATUS AND PLATING PROCESS METHOD

SUBSTRATE HOLDER AND SUBSTRATE TREATMENT APPARATUS

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND PLATING METHOD

METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE HOLDER AND PLATING APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POL...

POLISHING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

POLISHING APPARATUS AND POLISHING METHOD

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE PROCESSING APPARATUS