Masayuki Ohsawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Methods of making microelectronic assemblies
- Patent number 7,721,422
- Issue date May 25, 2010
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for wiring circuit substrate
- Patent number 7,546,681
- Issue date Jun 16, 2009
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for wiring circuit substrate
- Patent number 7,096,578
- Issue date Aug 29, 2006
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for wiring circuit substrates
- Patent number 6,828,221
- Issue date Dec 7, 2004
- North Corporation
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit substrate and manufacturing method therefor
- Patent number 6,646,337
- Issue date Nov 11, 2003
- North Corporation
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit substrate and manufacturing method thereof
- Patent number 6,528,874
- Issue date Mar 4, 2003
- North Corporation
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Methods of making microelectronic assemblies
- Publication number 20070209199
- Publication date Sep 13, 2007
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for wiring circuit substrate
- Publication number 20060258139
- Publication date Nov 16, 2006
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer wiring board, method for producing multi-layer wiring b...
- Publication number 20050097727
- Publication date May 12, 2005
- Tomoo Iijima
- B24 - GRINDING POLISHING
Information Patent Application
Manufacturing method for wiring circuit substrate
- Publication number 20040197962
- Publication date Oct 7, 2004
- NORTH CORPORATION
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring circuit substrate and manufacturing method therefor
- Publication number 20030151067
- Publication date Aug 14, 2003
- NORTH CORPORATION
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring circuit substrate and manufacturing method therefor
- Publication number 20030143833
- Publication date Jul 31, 2003
- NORTH CORPORATION
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR