Masumi Kameda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit module component and method of manufacturing ele...
- Patent number 8,929,089
- Issue date Jan 6, 2015
- TDK Corporation
- Shigeru Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure, printed wiring board, module substrate, and ele...
- Patent number 8,383,964
- Issue date Feb 26, 2013
- TDK Corporation
- Atsushi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating film, printed wiring board, and module substrate
- Patent number 8,183,463
- Issue date May 22, 2012
- TDK Corporation
- Atsushi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20240014112
- Publication date Jan 11, 2024
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20220148796
- Publication date May 12, 2022
- TDK Corporation
- Tomonaga NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELE...
- Publication number 20110229708
- Publication date Sep 22, 2011
- TDK Corporation
- Shigeru ASAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELE...
- Publication number 20110056744
- Publication date Mar 10, 2011
- TDK Corporation
- Atsushi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE
- Publication number 20110048774
- Publication date Mar 3, 2011
- TDK Corporation
- Atsushi SATO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...