Matthew J. Rutten

Person

Milton, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sputtered tungsten diffusion barrier for improved interconnect robu...
- Patent number 6,838,364
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reducing planarization defects
- Patent number 6,503,827
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Susan G. Bombardier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of column interconnect
- Patent number 6,495,917
- Issue date Dec 17, 2002
- International Business Machines Corporation
- John J. Ellis-Monaghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtered tungsten diffusion barrier for improved interconnect robu...
- Patent number 6,245,668
- Issue date Jun 12, 2001
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for removing slurry particles
- Patent number 6,171,436
- Issue date Jan 9, 2001
- International Business Machines Corporation
- Cuc K. Huynh
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for slurry polishing
- Patent number 6,110,832
- Issue date Aug 29, 2000
- International Business Machines Corporation
- Clifford O. Morgan
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical contact to buried SOI structures
- Patent number 6,071,803
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Matthew J. Rutten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision analog metal-metal capacitor
- Patent number 6,008,083
- Issue date Dec 28, 1999
- International Business Machines Corporation
- Terry J. Brabazon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical polishing device and method
- Patent number 5,928,062
- Issue date Jul 27, 1999
- International Business Machines Corporation
- Matthew Kilpatrick Miller
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing pad backside modifications for advantageous polishing...
- Patent number 5,913,713
- Issue date Jun 22, 1999
- International Business Machines Corporation
- Roger W. Cheek
- B24 - GRINDING POLISHING
Information Patent Grant
Method of removing slurry particles
- Patent number 5,896,870
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Cuc K. Huynh
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical contact to buried SOI structures
- Patent number 5,889,293
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Matthew J. Rutten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad with controlled release of desired micro-encapsulated...
- Patent number 5,876,266
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Matthew Kilpatrick Miller
- B24 - GRINDING POLISHING
Information Patent Grant
Gas discharge devices including matrix materials with ionizable gas...
- Patent number 5,877,589
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Clifford O. Morgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable travel carrier device and method for planarizing semicondu...
- Patent number 5,722,879
- Issue date Mar 3, 1998
- International Business Machines Corporation
- John Edward Cronin
- B24 - GRINDING POLISHING
Information Patent Grant
Precision analog metal-metal capacitor
- Patent number 5,708,559
- Issue date Jan 13, 1998
- International Business Machines Corporation
- Terry J. Brabazon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removing residue from a semiconductor wafer after chemi...
- Patent number 5,704,987
- Issue date Jan 6, 1998
- International Business Machines Corporation
- Cuc Kim Huynh
- B08 - CLEANING
Information Patent Grant
Selective polish process for titanium, titanium nitride, tantalum a...
- Patent number 5,676,587
- Issue date Oct 14, 1997
- International Business Machines Corporation
- William Francis Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transverse diffusion barrier interconnect structure
- Patent number 5,585,674
- Issue date Dec 17, 1996
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable travel carrier device and method for planarizing semicondu...
- Patent number 5,549,511
- Issue date Aug 27, 1996
- International Business Machines Corporation
- John E. Cronin
- B24 - GRINDING POLISHING
Information Patent Grant
Bidirectional field emission devices, storage structures and fabric...
- Patent number 5,530,262
- Issue date Jun 25, 1996
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming transverse diffusion barrier interconnect structure
- Patent number 5,488,013
- Issue date Jan 30, 1996
- International Business Machines Corporation
- Robert M. Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication methods for bidirectional field emission devices and st...
- Patent number 5,312,777
- Issue date May 17, 1994
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Version with markings to show changes made
- Publication number 20010029096
- Publication date Oct 11, 2001
- International Business Machines Corporation
- Stephen B. Brodsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Matthew J. Rutten

Person

Patents Grantslast 30 patents

Sputtered tungsten diffusion barrier for improved interconnect robu...

Method of reducing planarization defects

Method and structure of column interconnect

Sputtered tungsten diffusion barrier for improved interconnect robu...

Apparatus for removing slurry particles

Method and apparatus for slurry polishing

Electrical contact to buried SOI structures

Precision analog metal-metal capacitor

Vertical polishing device and method

CMP polishing pad backside modifications for advantageous polishing...

Method of removing slurry particles

Electrical contact to buried SOI structures

Polishing pad with controlled release of desired micro-encapsulated...

Gas discharge devices including matrix materials with ionizable gas...

Variable travel carrier device and method for planarizing semicondu...

Precision analog metal-metal capacitor

Process for removing residue from a semiconductor wafer after chemi...

Selective polish process for titanium, titanium nitride, tantalum a...

Transverse diffusion barrier interconnect structure

Variable travel carrier device and method for planarizing semicondu...

Bidirectional field emission devices, storage structures and fabric...

Method of forming transverse diffusion barrier interconnect structure

Fabrication methods for bidirectional field emission devices and st...

Patents Applicationslast 30 patents

Version with markings to show changes made