Matthias Heschel

Person

Copenhagen N, DK

People

Patents Grantslast 30 patents

Information Patent Grant
Package for a light emitting element
- Patent number 8,552,460
- Issue date Oct 8, 2013
- TSMC Solid State Lighting Ltd.
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a light emitting element
- Patent number 8,044,412
- Issue date Oct 25, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process for package with light emitting device on a sub...
- Patent number 7,732,234
- Issue date Jun 8, 2010
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly to house one or more micro components
- Patent number 7,681,306
- Issue date Mar 23, 2010
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabrication for chip scale package for a micro component
- Patent number 7,419,853
- Issue date Sep 2, 2008
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package for optical, electronic, opto-electroni...
- Patent number 7,388,285
- Issue date Jun 17, 2008
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly with self-alignment features to position a cover on a subs...
- Patent number 7,253,388
- Issue date Aug 7, 2007
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical device receiving substrate and optical device holding carrier
- Patent number 7,213,978
- Issue date May 8, 2007
- Hymite A/S
- Jochen Friedrich Kuhmann
- G02 - OPTICS
Information Patent Grant
Hermetically sealed package for optical, electronic, opto-electroni...
- Patent number 7,109,580
- Issue date Sep 19, 2006
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided etching technique for semiconductor structure with thr...
- Patent number 7,081,412
- Issue date Jul 25, 2006
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having through-holes sealed with feed-thro...
- Patent number 7,057,274
- Issue date Jun 6, 2006
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided etching technique for providing a semiconductor struct...
- Patent number 6,818,464
- Issue date Nov 16, 2004
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A LIGHT EMITTING ELEMENT
- Publication number 20110316015
- Publication date Dec 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LIGHT EMITTING ELEMENT
- Publication number 20090101897
- Publication date Apr 23, 2009
- HYMITE A/S
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Package For A Micro Component
- Publication number 20080315390
- Publication date Dec 25, 2008
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Process for Package With Light Emitting Device On A Sub...
- Publication number 20080199982
- Publication date Aug 21, 2008
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package for a micro component
- Publication number 20070035001
- Publication date Feb 15, 2007
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hermetically sealed package for optical, electronic, opto-electroni...
- Publication number 20060273449
- Publication date Dec 7, 2006
- Hymite A/S, a Kgs. Lyngby, Denmark corporation
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Techniques for providing a structure with through-holes that may be...
- Publication number 20050241135
- Publication date Nov 3, 2005
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Assembly with self-alignment features to position a cover on a subs...
- Publication number 20050236562
- Publication date Oct 27, 2005
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hermetically sealed package for optical, electronic, opto-electroni...
- Publication number 20050194677
- Publication date Sep 8, 2005
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor structure with one or more through-holes
- Publication number 20050059204
- Publication date Mar 17, 2005
- Hymite A/S, a Kgs, Lyngby, Denmark corporation
- Matthias Heschel
- G02 - OPTICS
Information Patent Application
Semiconductor structures having through-holes sealed with feed-thro...
- Publication number 20040266038
- Publication date Dec 30, 2004
- Hymite A/S, a Kgs. Lyngby, Denmark corporation
- Matthias Heschel
- G02 - OPTICS
Information Patent Application
Optical device receiving substrate and optical device holding carrier
- Publication number 20030215194
- Publication date Nov 20, 2003
- Jochen Friedrich Kuhmann
- G02 - OPTICS
Information Patent Application
Semiconductor structure with one or more through-holes
- Publication number 20030071283
- Publication date Apr 17, 2003
- Hymite A/S
- Matthias Heschel
- G02 - OPTICS

Matthias Heschel

Person

Patents Grantslast 30 patents

Package for a light emitting element

Package for a light emitting element

Fabrication process for package with light emitting device on a sub...

Method of forming an assembly to house one or more micro components

Method of fabrication for chip scale package for a micro component

Hermetically sealed package for optical, electronic, opto-electroni...

Assembly with self-alignment features to position a cover on a subs...

Optical device receiving substrate and optical device holding carrier

Hermetically sealed package for optical, electronic, opto-electroni...

Double-sided etching technique for semiconductor structure with thr...

Semiconductor structures having through-holes sealed with feed-thro...

Double-sided etching technique for providing a semiconductor struct...

Patents Applicationslast 30 patents

PACKAGE FOR A LIGHT EMITTING ELEMENT

PACKAGE FOR A LIGHT EMITTING ELEMENT

Chip Scale Package For A Micro Component

Fabrication Process for Package With Light Emitting Device On A Sub...

Chip scale package for a micro component

Hermetically sealed package for optical, electronic, opto-electroni...

Techniques for providing a structure with through-holes that may be...

Assembly with self-alignment features to position a cover on a subs...

Hermetically sealed package for optical, electronic, opto-electroni...

Semiconductor structure with one or more through-holes

Semiconductor structures having through-holes sealed with feed-thro...

Optical device receiving substrate and optical device holding carrier

Semiconductor structure with one or more through-holes